Senior FA Engineer (Semiconductors)

TL;DR

Senior FA Engineer (Semiconductors): Performing high-precision sample preparation and failure analysis for semiconductor packages and dies with an accent on imaging tools and chemical processing. Focus on operating RIE and milling systems, executing layer-by-layer polishing, and developing new FA methodologies to support emerging technologies.

Location: Kuala Lumpur, Malaysia

Company

hirify.global is a leading global semiconductor manufacturer.

What you will do

• Utilize a wide variety of sample preparation techniques and imaging tools, including SEM/EDX and backside IR.
• Operate precision milling, polishing, and Reactive Ion Etching (RIE) systems for EFA and PFA.
• Perform die extraction for various package types and execute layer-by-layer polishing.
• Document analysis results, detailed observations, and recommended corrective actions.
• Contribute to the development of new FA techniques, methodologies, and recipes.
• Evaluate tools to support emerging semiconductor technologies.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field.
• Proven experience (3+ years) in a semiconductor manufacturing or R&D environment.
• Hands-on experience with a broad range of FA sample preparation tools and techniques.
• Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.

Nice to have

• Wafer Fab experience.