Engineer for TAK ICP Dry Etching Process (Semiconductor)

Location: Tokyo, Takao, Japan; onsite

Company

hirify.global is the employing company for this full-time semiconductor process engineering role.

What you will do

• Develop new or modified InP-based lithography processes and define etching conditions and equipment requirements.
• Introduce dry etching and auto wet etching equipment and establish process conditions for mass-production capacity ramp-up.
• Apply developed technologies in product manufacturing, fabrication, and evaluation.
• Support process development from pilot-plant activities through full-scale manufacturing.
• Plan projects involving new process concepts, equipment automation, and improved manufacturing approaches.

Requirements

• Bachelor’s, master’s, or PhD degree in electronics, electrical engineering, physics, or a related technical field.
• At least 2 years of relevant experience with a bachelor’s degree, 1+ year with a master’s degree, or no relevant work experience required with a PhD.
• Required experience in optical semiconductor wafer processing, process improvement using dry etching or auto wet etching equipment, and wafer production technology.
• Fluent Japanese and business-level English for online meetings, email communication, and documentation.
• Strong on-time mindset.

Nice to have

• Practical experience in lithography, oxide film deposition, sputtering, or metal deposition.

Culture & Benefits

• Equal opportunity employment and a commitment to diversity.
• Reasonable accommodations are provided for individuals with disabilities during hiring and employment.