10 часов назад
Lead Physical Design Engineer (AI Chips)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Lead Physical Design Engineer (AI Chips): Driving end-to-end physical implementation of next-generation ASIC and SoC designs from synthesis through sign-off with an accent on PPA optimisation, timing closure, power integrity, and manufacturability. Focus on leading full-chip execution, developing EDA flows, integrating DFT and physical verification, and mentoring engineers across advanced AI chip projects.
Location: Bristol, United Kingdom
Company
develops chips and systems designed to accelerate inference for frontier AI models, targeting high-speed generation and long-context workloads.
What you will do
- Drive end-to-end physical implementation of ASIC and SoC designs, including floorplanning, placement, clock tree synthesis, routing, and sign-off.
- Lead full-chip execution, block ownership, physical design teams, or broader chip-level activities according to project needs.
- Perform synthesis, static timing analysis, timing closure, and PPA optimisation.
- Own power planning and analysis, including IR drop and electromigration mitigation.
- Ensure DRC, LVS, formal verification, and other physical verification requirements are met.
- Collaborate with RTL, architecture, verification, DFT, and process technology teams while improving EDA flows and mentoring engineers.
Requirements
- 10+ years of physical design experience for advanced technology nodes such as 7nm, 5nm, or below.
- Strong proficiency with EDA tools for place and route, STA, and sign-off, including Cadence Innovus, Synopsys Fusion Compiler, or Mentor Graphics Calibre.
- Strong understanding of CMOS technology, semiconductor physics, process limitations, timing closure, signal integrity, IR drop analysis, and formal verification.
- Proficiency in TCL, Perl, or Python for automation.
- Proven ability to own complex designs, lead physical design efforts, mentor engineers, and drive projects to completion.
- Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Computer Engineering, or a related field.
Nice to have
- Experience with HPC, AI accelerators, or networking chips.
- Experience or strong interest in using advanced AI tools and models in engineering workflows.
Culture & Benefits
- High ownership and autonomy in driving work forward.
- Rapid iteration and direct collaboration with top leadership.
- Full-stack collaboration across hardware, software, silicon, and modelling teams.
- Meaningful equity and ownership participation.
- Private medical, dental and vision coverage, contributory pension, 25 days of holiday plus bank holidays, and life and critical illness insurance.
- Inclusive office environment with a focus on diverse perspectives and teamwork.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
3 дня назад
ASIC Physical Design Lead
8 часов назад
Physical Design Engineer
200 000 - 400 000$
9 часов назад
Physical Design Technical Lead (AI)
209 500 - 299 200$
11 часов назад
Senior Physical Design Engineer (ASIC)
11 часов назад
Physical Design Engineer (AI Hardware)
5 часов назад
Technical Lead Physical Design Engineer (ASIC)
135 000 - 165 000$