Senior Package Reliability Engineer (Semiconductor Packaging)

Location: San Jose, California, United States

Salary: $166,900–$240,000 USD annually for the Bay Area, California.

Company

hirify.global is a pure-play FPGA solutions provider developing programmable technologies for AI, cloud, networking, and edge markets.

What you will do

• Characterize and qualify advanced 2.5D/3D semiconductor packages.
• Partner with package development, assembly, and manufacturing teams to select substrates and assembly materials.
• Develop and maintain thermal and thermomechanical finite element models using tools such as Ansys and Abaqus.
• Define and interpret coplanarity, warpage, and second-level reliability data collection strategies.
• Lead package reliability evaluations against JEDEC, MIL-STD, IPC, and AEC standards.
• Develop lifetime prediction models, customer reports, and package DFMEA/FMEA analyses.

Requirements

• Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field.
• 8+ years of experience in semiconductor package thermal and thermomechanical analysis.
• 8+ years of experience with thermal and thermomechanical simulation tools such as Ansys, Abaqus, or COMSOL.
• 8+ years of experience with advanced 2.5D, 3D, and heterogeneous integration packaging technologies.
• 3+ years of experience applying reliability statistics, failure analysis, and lifetime modeling techniques.
• 3+ years of experience developing Python scripts or software for automation, simulation workflows, data analysis, and post-processing.

Nice to have

• Deep understanding of thermal, mechanical, and thermomechanical characteristics of advanced flip-chip packages.
• Experience correlating thermomechanical simulations with dynamic warpage and surface-mount system-level assembly behavior.
• Experience developing customer-facing packaging risk assessment materials.

Culture & Benefits

• Regular full-time employment.
• Shift 1 schedule in the United States.
• Incentive opportunities based on individual and company performance.
• Applicants must be eligible for any required U.S. export authorizations.
• Artificial intelligence is used to screen, assess, or select applicants.