10 часов назад
Reliability Engineer (Hardware)
142 000 - 200 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Reliability Engineer (Hardware) (Semiconductor/Photonics): Designing and executing reliability qualification tests for integrated photonics-based AI platforms and photonics chiplet communication fabrics with an accent on failure analysis, device physics, and advanced packaging. Focus on developing test protocols, modeling device lifetimes, analyzing root causes, and driving improvements across product design and manufacturing.
Location: Mountain View, California, United States; flexible hybrid workplace model.
Salary: $142,000–$200,000 USD per year base salary, plus equity and other compensation.
Company
develops photonics-based infrastructure for AI and high-performance computing data centers, including 3D-stacked photonics engines and chiplet communication fabrics.
What you will do
- Develop reliability test plans based on product requirements, industry standards, and customer expectations.
- Execute qualification testing for integrated photonics-based AI platforms and photonics chiplet communication fabric products.
- Conduct FMEA and identify reliability risks in device design and manufacturing.
- Perform root cause analysis of device failures and collaborate with engineering and manufacturing teams on corrective actions.
- Establish internal reliability guidelines and standards.
- Use statistical analysis to model reliability performance, predict device lifetimes, and present technical reports and risk assessments.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a similar field.
- 5+ years of industry experience as a Reliability Engineer in the semiconductor and/or photonics industry.
- Knowledge of device and package reliability testing methods, including HTOL, HAST, TDDB, HTHH, and temperature cycling.
- Hands-on experience with failure analysis techniques and tools such as SEM, TEM, FIB, and EMMI.
- Knowledge of device physics, reliability, and failure mechanisms in SerDes, digital, or mixed-signal ICs.
- Understanding of packaging failure mechanisms involving TSVs, solder joints, warpage, and metal migration, plus familiarity with Weibull analysis, Minitab, or JMP.
Nice to have
- Experience with semiconductor or photonics device and module testing.
- Experience with flip-chip, wafer-level packaging, or 3D integration.
- Strong statistical analysis skills for comparing pre- and post-reliability data.
- Excellent communication and presentation skills.
- PhD in Electrical Engineering, Computer Engineering, or a similar field.
Culture & Benefits
- Flexible hybrid workplace model.
- Medical, dental, and vision coverage.
- Retirement savings matching, life insurance, and disability coverage.
- Vacation, sick leave, public holidays, and paid family leave.
- Training and development, commuter benefits, and equity grants for eligible full-time employees.
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