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10 часов назад

Sr. Staff Thermal Engineer (Semiconductor Packaging)

166 000 - 262 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr. Staff Thermal Engineer (Semiconductor Packaging): Developing and validating thermal solutions for advanced semiconductor packages and AI data center systems with an accent on CFD simulation, heat transfer modeling, and liquid and air cooling technologies. Focus on designing thermal management systems, validating complex electronic assemblies through experiments, and automating simulation workflows with Python or MATLAB.

Location: Boston, MA or Mountain View, CA, United States; flexible hybrid workplace model

Salary: $166,000–$262,000 USD per year, plus equity and other rewards

Company

hirify.global develops photonics-based infrastructure for AI and high-performance computing data centers, including 3D-stacked photonics engines and advanced package technologies.

What you will do

  • Perform thermal simulations to influence package and system design.
  • Develop and validate thermal models covering heat transfer, airflow, and thermal interactions in complex electronic assemblies.
  • Design and optimize thermal management solutions including heat sinks, thermal interface materials, heat pipes, vapor chambers, and liquid or air cooling systems.
  • Drive thermal characterization and validation through lab-scale prototypes and experiments with vendors.
  • Develop analytical, semi-empirical, and CFD tools, templates, best practices, and automation scripts in Python or MATLAB.
  • Communicate findings to internal stakeholders, suppliers, and customers, and document methodologies in technical reports.

Requirements

  • M.S. or Ph.D. in Mechanical Engineering, Materials Science, Chemical Engineering, or a related engineering field.
  • At least 5 years of experience in package or system thermal analysis.
  • Deep knowledge of thermal conduction and convective heat transfer.
  • Experience designing, modeling, testing, sourcing, and deploying advanced thermal management technologies.
  • Experience with steady-state and transient thermal analysis using ANSYS Icepak, ANSYS Fluent, and/or Flotherm.
  • Experience setting up and interpreting CFD simulations for complex geometries and boundary conditions, plus working knowledge of lab-scale validation techniques.

Nice to have

  • Knowledge of fluid dynamics and assembly process modeling for 2D/3D packaging technologies.
  • Experience with two-phase immersion cooling and single- or two-phase liquid flow.
  • Knowledge of thermal technologies for high-performance computing and data centers.
  • Experience developing thermal control algorithms and using DOE or JMP for statistical analysis.
  • Excellent communication skills and experience working in cross-functional teams.

Culture & Benefits

  • Medical, dental, and vision coverage.
  • Retirement savings matching program.
  • Life insurance, short- and long-term disability coverage, and paid family leave.
  • Vacation, sick leave, and public holidays.
  • Training and development, commuter benefits, and equity grants for full-time employees.

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