Advanced Packaging Reliability Lab Engineer (Semiconductors)

TL;DR

Advanced Packaging Reliability Lab Engineer (Semiconductors): Developing and maintaining environmental stress test systems for next-generation packaging technologies with an accent on DC power systems, instrumentation, and reliability analysis. Focus on characterizing equipment performance, implementing statistical process control, and ensuring high-quality data for critical technology qualification decisions.

Location: Must be based on-site in Phoenix, Arizona

Salary: $133,800–$188,890 USD

Company

hirify.global is a global leader in semiconductor manufacturing and technology innovation, driving advancements in silicon process and packaging for the AI era.

What you will do

• Develop and maintain environmental stress systems for evaluating silicon and package reliability.
• Characterize equipment performance and respond to technical issues or excursions.
• Translate reliability stress analysis requirements into effective fixturing and innovative test solutions.
• Implement and analyze statistical process control methods to ensure high-quality data.
• Coordinate with tool vendors and field service engineers to maintain lab operations.
• Collaborate with internal operations, planning, and facilities teams to support technology development.

Requirements

• Master's degree in Electrical Engineering with 3+ years of experience or PhD in Electrical Engineering.
• Must be able to work on-site in Phoenix, Arizona.
• Strong understanding of DC electrical systems, including operation, troubleshooting, and calibration.
• Experience with electrical measurement and data acquisition equipment like DMMs and thermocouple systems.
• Ability to diagnose and resolve issues involving electrical hardware, wiring, and control systems.
• Familiarity with instrumentation communication protocols and electrical schematics.

Nice to have

• Experience with scripting and automation tools such as Python, LabVIEW, or JMP.
• Knowledge of calibration practices and standards like ISO 9001 and 17025.
• Understanding of sensor integration including RTDs and environmental monitoring devices.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health and retirement benefit programs.
• Opportunities to work on cutting-edge packaging technologies like EMIB and Foveros.
• Collaborative environment dedicated to engineering excellence.
• Paid vacation and time-off programs.