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14 часов назад

Senior Silicon Substrate & Packaging Manufacturing Engineer (AI)

Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
UK/Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Senior Silicon Substrate & Packaging Manufacturing Engineer (AI): Owning substrate and package assembly manufacturing in Taiwan, from first silicon through high-volume production, with an accent on yield, NPI readiness, supplier performance, and packaging reliability. Focus on ramping complex FC-BGA and advanced packages, solving process and reliability excursions, and building scalable manufacturing controls for high-density AI hardware.

Location: Taiwan

Company

hirify.global is building silicon, systems, and software for high-speed, lower-cost AI model execution. Founded in 2022, the company has a team of more than 70 people and offices in London and Bristol.

What you will do

  • Own packaging manufacturing execution, assembly yield, and ramp performance in Taiwan.
  • Define manufacturing readiness criteria and lead EVT, DVT, and PVT builds through high-volume manufacturing.
  • Lead root-cause analysis, corrective actions, excursion response, and data-driven process monitoring across OSAT and substrate partners.
  • Set technical performance expectations for OSATs and substrate suppliers and drive improvements in yield, cycle time, process capability, and cost.
  • Own qualification, reliability closure, failure analysis, and packaging robustness for high-current-density AI workloads.
  • Define ramp plans, track yield maturation, mitigate substrate and capacity risks, and lead post-ramp cost-down initiatives.

Requirements

  • 8+ years of experience in semiconductor packaging manufacturing or product engineering.
  • Proven experience ramping complex FC-BGA or advanced packages to volume.
  • Deep knowledge of flip-chip assembly, large-body substrate warpage control, underfill and reliability interactions, assembly defect Pareto analysis, SPC, and process capability metrics.
  • Strong experience working directly with Taiwan OSATs and substrate vendors.
  • Demonstrated ownership of yield improvement programs.

Nice to have

  • Experience with large AI or HPC ASICs.
  • Exposure to 2.5D or high-bandwidth memory packaging.
  • Experience ramping first-generation silicon in a startup or fast-scaling environment.
  • Fluent Mandarin and English.

Culture & Benefits

  • Collaborative, problem-solving culture based on curiosity, entrepreneurial initiative, and technical fluency.
  • Modern, open offices in London and Bristol.
  • High-accountability environment with direct influence on hardware manufacturing strategy and company growth.
  • Some roles may involve export-controlled technologies and additional eligibility checks under applicable law.

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