Component Process Engineer (FR4/PCB)

Location: San Jose, United States; 30–50% travel in Asian countries

Company

hirify.global is a well-funded startup developing photonics infrastructure for AI supercomputing, including optical interconnects and scalable photonic engines.

What you will do

• Serve as the primary substrate engineering interface between hardware design, package manufacturing, and worldwide substrate suppliers.
• Identify, develop, and qualify FR4/PCB substrate suppliers.
• Lead DFM, DFT, and DFR activities, risk analysis, and mitigation planning with suppliers.
• Lead PCB quality control, failure analysis, and reliability testing.
• Support process development with packaging production teams across SMT, die attach, wire bonding, active alignment, and testing.

Requirements

• B.S. or M.S. in Material, Chemistry, or Mechanical Engineering.
• 8+ years of experience in FR4 substrate or PCB development or manufacturing.
• In-depth knowledge of mSAP and Any-Layer HDI processes for high-speed optical transceiver applications, including equipment, materials, and process capabilities.
• Experience with Cadence, SolidWorks, JMP, PCB test methodologies, FMEA, Control Plans, SPC, and 8D.
• Fluent English required for communication with English-speaking stakeholders.
• Ability to travel 30–50% in Asian countries.

Nice to have

• M.S. in Electrical or Manufacturing Engineering.
• Experience with optical transceiver manufacturing, including SMT, die attach, wire bonding, and active alignment.
• Six Sigma and statistical analysis skills.

Culture & Benefits

• Ground-floor opportunity at a high-growth photonics startup.
• Work with experienced engineers on optics, systems, and manufacturing challenges.
• Competitive salary and meaningful equity.
• Comprehensive health, dental, and vision coverage.