Die Attach Manufacturing Engineer – Process & Equipment (Silicon Photonics / PIC Packaging)

Location: Singapore; cleanroom and manufacturing floor environment

Company

hirify.global is developing photonics infrastructure for AI supercomputing, focused on faster, cooler, and more energy-efficient computing.

What you will do

• Develop, characterize, qualify, optimize, and sustain die attach processes for PICs, silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies.
• Establish process specifications, work instructions, control plans, and DOE-based process windows for sub-micron placement accuracy.
• Lead root cause analysis and CAPA for optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, and bond-line thickness issues.
• Support NPI for photonic packages, transceiver modules, and hybrid or co-packaged optical integration platforms.
• Own equipment performance, uptime, OEE, installation, IQ/OQ/PQ qualification, preventive maintenance, troubleshooting, and ramp-up for precision die bonding and alignment tools.
• Drive automation, tooling, fixture, capacity, cost-reduction, Lean, and Six Sigma improvements while tracking yield, Cpk, uptime, scrap rate, and cycle time.

Requirements

• Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or a related field; a Master’s degree is preferred for senior roles.
• 3–7 years of hands-on silicon photonics or PIC industry experience focused on die attach process and equipment engineering for optical or optoelectronic packaging.
• Direct experience with silicon photonics or III-V laser dies, including wafer/die handling, dicing, facet protection, and optically sensitive placement.
• Working knowledge of low-outgassing and optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding, and related failure modes.
• Experience with high-precision die or fiber attach equipment and familiarity with DOE, SPC, Cpk, 8D, 5-Why, and Fishbone analysis.
• Ability to work on production lines, stand for extended periods, support flexible shifts when needed, interpret engineering drawings and specifications, and travel occasionally to equipment vendors.

Nice to have

• High-volume silicon photonics, optical transceiver, PIC foundry, or packaging-house experience.
• Active alignment and real-time optical feedback-based die bonding experience.
• Experience with hermetic packaging, TECs, laser die attach, Six Sigma certification, Minitab or JMP, MES/data systems, automation, robotics, or cleanroom manufacturing.

Culture & Benefits

• Competitive salary and benefits package.
• Work on photonics packaging technology for AI supercomputing.
• Collaborative, cross-functional engineering environment.
• Career growth within process and manufacturing engineering.
• Gowning may be required in the cleanroom, with work near production equipment.