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53 минуты назад

Manufacturing Engineer (Semiconductor)

Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Manufacturing Engineer (Semiconductor): Supporting assembly and module NPIs, second sourcing, engineering builds, production qualifications, reliability activities, and failure analysis with an accent on semiconductor packaging, material sourcing, and qualification tracking. Focus on coordinating with CMs, OSATs, material suppliers, reliability engineers, and device analysis teams while documenting design approvals, equipment operations, and failed-unit investigation workflows.

Location: Singapore; hybrid work policy

Company

hirify.global develops low-power wireless connectivity and highly integrated semiconductor SoCs for smart home, industrial IoT, and smart city applications.

What you will do

  • Support assembly and module new product introductions and second-sourcing programs.
  • Work with contract manufacturers, OSATs, and material suppliers to source materials and research product BOMs.
  • Support package design reviews, design-file acceptance, and design and BOM approvals.
  • Create engineering build requests and track qualification documentation and reports.
  • Support reliability laboratory activities, including chamber operations, maintenance and calibration coordination, and qualification lot tracking.
  • Support failure analysis by coordinating with the Device Analysis team and creating tracking and documentation processes for failed units.

Requirements

  • Diploma in a related engineering field.
  • At least 2 years of experience in assembly manufacturing or a reliability laboratory environment.
  • Good communication skills.
  • Familiarity with reliability equipment, bond diagrams, or assembly materials.
  • Basic knowledge of package design rules.

Culture & Benefits

  • Flexible work policy.
  • Insurance plans with outpatient coverage.
  • Exposure to assembly and package engineering, reliability engineering, and failure analysis functions.
  • Collaboration with manufacturing partners and material suppliers.

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