Staff Engineer, Packaging Engineering (FIB)

Location: Batu Kawan, Penang, Malaysia; onsite at the Penang SDSM Office

Company

hirify.global develops Flash memory and advanced semiconductor products supported by global manufacturing and supply-chain operations.

What you will do

• Develop and maintain package recipe and process baselines based on failure-analysis findings.
• Perform device-level physical failure analysis using mandatory SEM and FIB techniques.
• Conduct FIB cross-sectioning, delayering, defect localization, and SEM imaging to identify root causes.
• Evaluate package reliability and robustness in response to wafer-fabrication process changes.
• Lead package evaluation and qualification for NAND and ASIC technologies.
• Provide failure-analysis recommendations for chip-structure optimization and package and product design decisions.

Requirements

• Bachelor’s degree or higher in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related discipline.
• More than 3 years of hands-on SEM and FIB experience is mandatory.
• Solid experience in physical failure analysis of semiconductor devices.
• Strong understanding of device structures, packaging architectures, and failure mechanisms.
• Good English communication skills, written and spoken, are required.
• Ability to collaborate effectively with global, cross-functional teams.

Nice to have

• Background in wafer-fabrication processes and device design.
• Experience with NAND or ASIC technologies.
• Familiarity with electrical and physical characterization methods.
• Knowledge of assembly processes and advanced semiconductor packaging.
• Experience supporting fab or package process-change qualification.

Culture & Benefits

• Full-time exempt position.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accessibility support is available throughout the application and hiring process.