DFM Engineer (Optical Transceivers)

Location: Singapore

Company

hirify.global develops high-speed photonics products for AI infrastructure and high-performance computing.

What you will do

• Lead DFM/DFR for pluggable, NPO, and CPO optical transceiver designs.
• Evaluate the capabilities and risks of manufacturing processes, equipment, and materials.
• Support optical transceiver assembly processes including SMT, die attach, wire bonding, flip chip, TCB bonding, underfill, FAU active alignment, mechanical assembly, and reliability testing.
• Engage with substrate, optical, and chip design teams, production and NPI lines, packaging teams, and component and material suppliers during early development.
• Collect, review, and summarize production data to support timely technical decisions.

Requirements

• Bachelor’s or master’s degree in materials, chemistry, or mechanical engineering.
• 10+ years of experience in transceiver assembly process development or similar products.
• In-depth knowledge of packaging materials including solder, epoxy, glass, and ceramic.
• Hands-on familiarity with SMT, die bonders, active aligners, TCB bonding, and typical process capabilities.
• Experience with Cadence, SolidWorks, JMP, FMEA, Control Plans, SPC, and 8D.
• Fluent English required for communication with global stakeholders.

Culture & Benefits

• Cross-functional collaboration across hardware design, packaging, manufacturing, NPI, and supplier teams.
• Work on photonics products supporting AI infrastructure and high-performance computing.
• Global stakeholder and supplier engagement.