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13 часов назад

Principal Digital Design Engineer (AI Infrastructure)

185 000 - 230 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Principal Digital Design Engineer (AI Infrastructure): Architecting and implementing complex digital blocks and subsystems for high-performance AI connectivity solutions with an accent on RTL design, micro-architecture, timing closure, and DFT for advanced CMOS nodes. Focus on delivering production silicon supporting PCIe, CXL, UALink, Ethernet, and DDR protocols, integrating third-party IP, and debugging designs through silicon bring-up.

Location: San Jose, California, United States

Salary: $185,000–$230,000 per year, depending on experience, level, and business need. The role may also include discretionary bonuses, incentives, and benefits.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and its COSMOS software suite, supporting hyperscalers and ecosystem partners.

What you will do

  • Architect and implement complex digital blocks and subsystems, defining micro-architecture and driving RTL implementation.
  • Optimize power, performance, and area for silicon technologies better than 7nm.
  • Lead timing closure and implement Design-for-Test features.
  • Drive designs through production, maintaining quality, schedule, and delivery accountability.
  • Collaborate with verification, physical design, DFT, and post-silicon teams on test plans, coverage closure, IP integration, sign-off, silicon bring-up, and debug.
  • Mentor junior engineers and improve silicon development methodologies and CAD automation.

Requirements

  • Bachelor’s degree in Electrical Engineering or equivalent.
  • 10+ years of hands-on experience developing complex SoC or silicon products in server, storage, and/or networking markets.
  • Expertise in architecture definition, micro-architecture, RTL coding, functional simulation, and synthesis.
  • Strong understanding of timing closure, gate-level simulation, and DFT implementation.
  • Deep expertise in at least one high-speed protocol, including PCIe, CXL, Ethernet, DDR, or a similar technology.
  • Production experience with advanced CMOS nodes of 7nm or smaller, plus proficiency with Cadence and/or Synopsys digital design flows.

Nice to have

  • Master’s degree in Electrical Engineering or a related field.
  • Experience delivering multiple high-performance designs to production in data-center environments.
  • Collaboration experience with embedded firmware teams and familiarity with RISC-V, Arm, or similar processor subsystems.
  • Contributions to design methodology, CAD automation, or design infrastructure.

Culture & Benefits

  • Work on connectivity technologies for AI infrastructure and products deployed by leading hyperscalers.
  • Collaborative environment involving verification, physical design, DFT, firmware, and post-silicon teams.
  • Opportunity to contribute to high-performance silicon and advanced semiconductor technology.
  • Potential eligibility for discretionary bonuses, incentives, and benefits.
  • Inclusive workplace encouraging applications from people with diverse backgrounds and experiences.

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