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7 часов назад

Engineering Program Management, Systems Build (AI Hardware)

120 000 - 300 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Engineering Program Management, Systems Build (AI Hardware): Leading end-to-end system builds for AI consumer products from local prototypes through Proto, xVT, ramp, and launch with an accent on hardware validation, manufacturing execution, and supply chain readiness. Focus on coordinating cross-functional engineering teams, driving vendor and contract manufacturer engagements, and resolving schedule, material, and yield risks during critical builds.

Location: San Jose, with flexible location and up to 30% in-region travel, including extended stays at factory sites during critical builds.

Salary: $120,000–$300,000 annual base salary.

Company

hirify.global develops personalized multimodal intelligence and next-generation AI hardware as a unified interface between humans and machines.

What you will do

  • Lead build planning and execution from early local prototypes through Proto, xVT, ramp, and launch.
  • Coordinate EE, ME, SI, RF, thermal, reliability, and other engineering disciplines to cover validation needs efficiently.
  • Drive technical engagements with vendors and contract manufacturers on design, process, and yield.
  • Own materials readiness, build schedules, and unit distribution across configurations.
  • Identify and close schedule, material, and yield risks through cross-functional decision-making.
  • Communicate program status, risks, and key decisions to engineering and leadership.

Requirements

  • 6+ years of experience executing and shipping high-technology consumer electronics systems at large OEMs.
  • Bachelor’s degree in electrical, mechanical, or related engineering.
  • End-to-end hardware build leadership with contract manufacturers and experience driving critical supply chain components.
  • Experience with high-technology manufacturing processes, component lead times, and PCB technologies.
  • Experience taking programs through prototype, xVT, ramp, and mass production.
  • Excellent interpersonal communication and information visualization skills; ability to travel in-region, including extended stays during critical builds.

Nice to have

  • Master’s degree in an engineering discipline.
  • Deep engineering and manufacturing experience with consumer electronic module technologies.
  • Experience leading large-scale NPI programs across global contract manufacturing partners.
  • Familiarity with BOM management, ECO flows, and validation DOE planning.
  • Strong technical judgment, decisiveness in ambiguity, and the ability to escalate appropriately.

Culture & Benefits

  • Work on proactive, multimodal AI systems capable of interacting through speech, text, vision, and persistent memory.
  • Develop AI hardware and multimodal models together as a unified product interface.
  • Full-time employment with annual US base salary of $120,000–$300,000.
  • Travel to factory sites to direct execution and resolve issues on the production floor.

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