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15 часов назад

Technician 5, Manufacturing Equipment (Die Prep)

Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
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TL;DR
Technician 5, Manufacturing Equipment (Die Prep) (Semiconductor Equipment Maintenance): Sustaining, troubleshooting, and optimizing Die Prep equipment in a high-volume semiconductor manufacturing environment with an accent on preventive maintenance, equipment qualification, machine conversion, and uptime. Focus on leading root cause analysis, coordinating corrective and preventive actions, analyzing equipment performance data, and mentoring junior technicians.

Location: Onsite in Batu Kawan, Penang, Malaysia

Company

A global manufacturer of Flash memory and advanced memory technology products with advanced semiconductor manufacturing capabilities.

What you will do

  • Sustain, set up, qualify, convert, and perform preventive maintenance on Die Prep equipment.
  • Troubleshoot complex equipment issues and conduct root cause analysis using 5 Why, Fishbone, and failure analysis methods.
  • Respond to major machine breakdowns, coordinate recovery actions, and support equipment uptime targets.
  • Execute equipment upgrades and continuous improvement initiatives to improve reliability and productivity.
  • Collaborate with Process, Manufacturing, Quality, and Engineering teams on yield excursions, process abnormalities, and equipment-related quality issues.
  • Analyze equipment performance data, maintain technical documentation, and mentor junior technicians.

Requirements

  • Diploma or Advanced Diploma in Electrical and Electronic Engineering, Mechatronics Engineering, Mechanical Engineering, or an equivalent technical discipline.
  • 3–5 years of hands-on experience in semiconductor equipment maintenance, troubleshooting, and sustaining support.
  • Strong experience with Die Prep equipment maintenance, preventive and corrective actions, machine conversion, and equipment qualification.
  • Ability to perform systematic troubleshooting, root cause analysis, and equipment performance optimization in high-volume manufacturing.
  • Advanced diagnostic skills across electrical, mechanical, pneumatic, servo, and automation systems.
  • Ability to work onsite in Batu Kawan, Penang, Malaysia and collaborate across functional teams.

Nice to have

  • Experience with Backgrind, Wafer Saw, Wafer Mounting, Taping, and Die Prep processes.
  • Experience leading equipment improvement, machine upgrade, cost reduction, and productivity enhancement projects.
  • Familiarity with FMEA, SPC, CAPA, and other statistical problem-solving tools.
  • Experience mentoring junior technicians and coordinating yield improvement activities.

Culture & Benefits

  • Inclusive environment focused on diversity, belonging, respect, and contribution.
  • Opportunity to support advanced 4IR semiconductor manufacturing and sustainability initiatives.
  • Full-time, non-exempt employment position.
  • Accommodation support is available during the application and hiring process.

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