Silicon Photonics Engineer (CPO)

Location: Singapore — on-site

Company

hirify.global is a well-funded startup developing silicon photonics infrastructure, optical interconnects, and photonic engines for AI supercomputing and high-performance computing.

What you will do

• Develop and optimize silicon photonic devices and building blocks for Co-Packaged Optics platforms.
• Create and refine process integration flows, including backend and advanced packaging steps for photonic assembly.
• Support the evolution of PDK components and design rules for reliable, high-volume production.
• Guide products from early development and NPI through qualification and ramp-to-production.
• Investigate device and process issues, drive corrective actions, and improve yield and platform capability.
• Collaborate with R&D, fabrication, reliability, product engineering, customers, and partners on technical requirements and manufacturability.

Requirements

• MS or PhD in Electrical Engineering, Electrical and Computer Engineering, or a related field.
• Strong foundation in silicon photonic device design, optical interconnects, and photonic integration.
• Experience with process integration, backend assembly, or advanced packaging for photonic systems.
• Experience transitioning photonic technologies from development into production.
• Hands-on experience with device design, cleanroom fabrication, and photonic device testing or characterization.
• Strong analytical, problem-solving, collaboration, and technical communication skills.

Nice to have

• Experience with CPO architectures, high-speed optical interconnects, or photonic packaging.
• Experience developing or contributing to silicon photonics PDKs.
• Exposure to Cu bumping, laser diode attach, TSV, or fiber-related assembly.
• Customer-driven development, industry collaborations, publications, patents, or recognized contributions in silicon photonics.

Culture & Benefits

• Competitive salary based on experience.
• Comprehensive benefits package including health insurance.
• Professional development opportunities and certification support.
• Access to advanced photonics technology and packaging environments.
• Collaborative work with multidisciplinary teams on complex engineering challenges.