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16 часов назад

Package R&D Engineer (New Grad) (Power Semiconductors)

Тип работы
fulltime
Грейд
trainee
Английский
c1
Страна
China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Package R&D Engineer (New Grad) (Power Semiconductors): Developing new semiconductor package types and structures with an accent on packaging materials, reliability, cost requirements, and package design rules. Focus on surveying materials, collecting cross-functional packaging requirements, maintaining package design standards, and updating the package roadmap.

Location: Hong Kong, China

Company

hirify.global develops integrated power semiconductors and power delivery architectures for customers worldwide.

What you will do

  • Develop new semiconductor package types and package structures.
  • Survey packaging materials against process, reliability, and cost requirements.
  • Collect packaging requirements and market information from TME, design engineering, marketing, and competitors.
  • Document package design and process experience, maintain package design rules, and update the package roadmap.
  • Complete additional tasks assigned by the supervisor.

Requirements

  • Doctoral degree in packaging or power electronics.
  • Good knowledge of package development principles.
  • Knowledge of the semiconductor supply chain, including assembly subcontractors and packaging material vendors.
  • Fluent spoken and written English.

Nice to have

  • Familiarity with AutoCAD or Cadence software.

Culture & Benefits

  • Full-time employment in the semiconductor industry.
  • Work on leading-edge integrated power semiconductor and power delivery technologies.
  • Environment focused on creativity, sustainability, and innovation.
  • Equal opportunity workplace committed to diversity.

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