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15 часов назад

Optical-Electronic Packaging Engineer (AI & Data Center Optical Modules)

134 750 - 192 500$
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Optical-Electronic Packaging Engineer (AI & Data Center Optical Modules): Designing and developing advanced mechanical and thermal packaging for high-speed optical modules used in AI and data center interconnect systems with an accent on high-density packaging, thermal management, and manufacturability. Focus on driving concepts from system architecture through validation and production ramp, performing FEA and tolerance analysis, and building scalable tooling and test infrastructure.

Location: San Jose, California, USA; on-site. International travel of up to 25% is required for manufacturing and contract manufacturing sites.

Salary: $134,750–$192,500 per year.

Company

hirify.global develops optical and photonic solutions for AI, cloud computing, data centers, telecommunications, and advanced manufacturing.

What you will do

  • Design mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems.
  • Drive mechanical concepts from system architecture and detailed design through prototyping, EVT/DVT validation, and high-volume production ramp.
  • Create 3D CAD models, engineering documentation, GD&T definitions, and tolerance stack-up analyses.
  • Perform thermal and mechanical stress analysis using FEA to address power density, airflow constraints, and reliability.
  • Design fixtures, tooling, and test infrastructure for optical alignment, module validation, and scalable manufacturing.
  • Collaborate with optical, electrical, thermal, reliability, manufacturing, and supply-chain teams on integrated solutions.

Requirements

  • B.S. in Mechanical Engineering or a related discipline; an M.S. or Ph.D. is preferred.
  • Relevant industry or project experience in mechanical design, thermal management, structural analysis, and high-density packaging.
  • Proficiency with SolidWorks, FloTHERM, or equivalent CAD and FEA tools.
  • Experience with GD&T, tolerance stack-up analysis, optoelectronic or high-speed electronic products, and design for manufacturability or assembly.
  • Ability to work independently on complex technical problems in a cross-functional R&D and NPI environment.
  • Willingness to travel internationally up to 25% to support manufacturing readiness, yield improvement, and production ramp.

Nice to have

  • Five or more years of relevant industry experience for senior-level consideration.
  • Experience with data center, AI, or high-performance computing applications.
  • Knowledge of JMP and basic scripting or programming with VB, C, MATLAB, or similar tools.

Culture & Benefits

  • Flexible time off and health and wellness benefits.
  • Tuition reimbursement and career growth support.
  • Employee stock options and incentive plans.
  • On-site gym, games room, prayer room, subsidized meals, and free coffee and tea.
  • Collaborative, innovative, and inclusive work environment.

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