Optical Test Engineer, Principal (Co-Packaged Optics)

Location: San Jose, California, United States

Salary: $185,000–$240,000 per year, depending on experience, level, and business need. Discretionary bonus, incentives, and benefits may be available.

Company

hirify.global provides rack-scale AI infrastructure through connectivity solutions based on CXL, Ethernet, NVLink, PCIe, UALink, and its COSMOS software suite.

What you will do

• Lead the definition, development, and qualification of test solutions for Co-Packaged Optics optical engines across wafer, die, package, and system levels.
• Design optical test hardware and automation systems for active alignment, fiber attachment, and high-speed optical I/O characterization.
• Develop test programs for insertion loss, eye diagrams, BER, PAM4 signaling, optical power, wavelength, thermal performance, and reliability stress testing.
• Collaborate with silicon photonics, package engineering, product engineering, and manufacturing teams to improve design-for-test and manufacturability.
• Drive yield improvement, failure analysis, root-cause investigations, and correlation between laboratory validation, ATE production testing, and system performance.
• Provide technical direction and mentorship while evaluating instrumentation, automation frameworks, and next-generation CPO test capabilities.

Requirements

• MS or PhD in Electrical Engineering, Optical Engineering, Physics, or a related field.
• 8+ years of relevant optical or photonic test engineering experience for Senior Staff level, or 12+ years for Principal level.
• Strong experience with Co-Packaged Optics, silicon photonics, or high-speed optical transceivers rated at 800G/1.6T or above.
• Experience developing optical test solutions for wafer-, package-, or module-level testing in high-volume environments.
• Expertise with optical spectrum analyzers, BER testers, oscilloscopes, tunable lasers, power meters, and fiber alignment systems.
• Experience with ATE, Python, LabVIEW, or C# test development, SPC, PAM4 signaling, signal integrity, mixed-signal testing, and reliability standards for data center optics.

Nice to have

• Experience with active alignment, thermal management, laser integration, fiber attachment, and co-packaged ASIC testing.
• Familiarity with IEEE 802.3, OIF, CMIS, hyperscalers, or optical module vendors.
• Experience with semiconductor foundry or OSAT ecosystems and transitioning products from NPI to high-volume production.
• Technical leadership experience, patents, or publications in photonics testing.

Culture & Benefits

• Work on high-bandwidth CPO solutions for AI infrastructure, hyperscale data centers, and high-performance computing.
• Collaborate across silicon photonics, packaging, product engineering, and manufacturing functions.
• Discretionary bonus, incentives, and benefits may be available.
• Applications are encouraged from people with diverse backgrounds and experiences.