Lead Mechanical Engineer (AI Data Centers)

Location: Hybrid, based in Helsinki or across EMEA, with travel to sites as projects require

Company

hirify.global is building a full-stack AI cloud spanning data centers, hardware, and a cloud platform for AI teams.

What you will do

• Design cooling architecture for high-density AI and GPU halls, including CRAC/CRAH units, chillers, and liquid or direct-to-chip cooling.
• Define airflow management and hot- and cold-aisle containment strategies.
• Plan thermal capacity across data center facilities.
• Optimize designs for energy efficiency and low PUE.
• Coordinate mechanical designs with electrical, structural, and controls engineering disciplines.

Requirements

• BS in Mechanical Engineering.
• 7–10 years of experience in HVAC or mission-critical cooling design.
• Experience designing mission-critical cooling systems at scale.
• Strong understanding of PUE optimization and thermal modelling.
• Proven ability to coordinate across engineering disciplines.
• Senior to Lead level; full-time and permanent employment.

Nice to have

• Direct-to-chip or immersion liquid cooling experience.
• Data center or other high-density industrial facility experience.
• Familiarity with building in the Nordics.

Culture & Benefits

• Cash and equity compensation.
• Healthcare, lunch, wellbeing, and other fringe benefits.
• Opportunity to work with engineers, researchers, and partners across the global AI ecosystem.
• International environment with more than 30 nationalities.

Hiring process

• Submit an application through the Careers page; applications by email are not accepted.
• Hiring proceeds without an artificial deadline and moves forward when a suitable candidate is identified.