Chip Lead, Senior Director (UALink)

Location: San Jose, California, United States, or Israel

Company

hirify.global develops semiconductor-based connectivity solutions and software for rack-scale AI infrastructure and hyperscale data centers.

What you will do

• Own the full technical lifecycle of UALink switching products, including architecture, design integration, validation, readiness, tapeout, signoff, and customer enablement.
• Drive chip development from RTL to GDSII and ensure architecture, implementation, tapeout, and quality milestones are achieved.
• Lead development of 300–400 mm² chips using 2.5D/3D advanced packaging and chiplet-based architectures.
• Coordinate design verification, DFT, physical design, firmware, systems, and operations to surface and resolve risks and dependencies.
• Guide verification coverage, regression strategies, scan insertion, BIST, manufacturing test, timing closure, and power optimization.
• Establish scalable processes, documentation, decision-making practices, and technical leadership standards across the product line.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 15+ years of experience across architecture, silicon design, validation, systems, or related domains.
• Proven experience taking large-scale chips of 300 mm² or larger through successful tapeout.
• Hands-on experience with 2.5D/3D advanced packaging, chiplet architectures, RTL design, design verification, DFT, and physical design flows.
• Experience with high-speed serial interfaces such as PCIe or Ethernet and switching architectures.
• Experience leading cross-functional technical programs with end-to-end product ownership, strong communication, and executive presence.

Nice to have

• Master’s degree in Electrical Engineering or Computer Engineering.
• Experience with UALink, UCIe, PCIe Gen5/Gen6/Gen7, or Ethernet switching architectures.
• Experience with 7nm, 5nm, or smaller process nodes.
• Background in power management, clocking architectures, or high-speed analog integration.
• Experience in fast-growing startup or hyperscale environments.

Culture & Benefits

• Emphasis on systems thinking, adaptability, execution discipline, and calm leadership under pressure.
• Focus on ownership, accountability, mentoring, technical judgment, and cross-functional collaboration.
• Commitment to diverse ideas, backgrounds, and experiences in engineering teams.