Structural, Thermal & Packaging Analyst (Semiconductor FEA)

Location: Santa Clara, CA, United States

Salary: $176,000–$242,000 per year

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Lead or execute complex engineering projects, research initiatives, and new technology development.
• Define experiments, determine meaningful evaluation data, and lead feasibility studies for complete systems and subsystems.
• Lead module and submodule design, system qualification, and the definition of system requirements and specifications.
• Investigate and troubleshoot complex physics-related system issues in laboratory and field environments.
• Evaluate emerging and competitor technologies, demonstrate new capabilities, and support product risk management decisions.
• Manage strategic vendors and collaborate with customers, universities, consortia, and internal and external technical stakeholders.

Requirements

• Deep or broad expertise in a specialized engineering or physics discipline.
• Strong analytical problem-solving skills and the ability to lead others in solving complex technical problems.
• Experience leading engineering projects or functional teams with moderate resource, risk, and complexity requirements.
• Ability to interpret business and technical challenges, recommend best practices, and influence requirements and risk decisions.
• Ability to communicate difficult technical concepts and negotiate technical decisions with stakeholders.
• Willingness to travel approximately 10% of the time.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Additional compensation may include bonus and stock awards, where applicable.
• Relocation eligibility is available.