Packaging Integration Engineer (Silicon Photonics)

Location: Essex Junction, United States; travel up to 25% to other facilities or external partner sites may be required.

Salary: $143,000–$247,000 per year

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services, with manufacturing operations across three continents.

What you will do

• Define, design, and qualify optical packaging architectures for silicon photonics modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop scalable fiber-to-chip coupling strategies such as V-groove, passive alignment, and lens integration for high-density optical I/O.
• Drive heterogeneous integration of photonic and electronic components using 2.5D, 3D, and 3.5D packaging technologies.
• Run thermal, mechanical, and optical simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and failure-analysis tools.
• Support mass-production readiness, process transfer, cost modeling, technical roadmaps, and collaboration with OSATs and external partners.

Requirements

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering, or a related field.
• 8+ years of experience in semiconductor packaging, preferably focused on photonic or advanced packaging.
• Hands-on experience with fiber attach, photonic alignment, and optical coupling techniques.
• Knowledge of die attach, flip-chip, underfill, molding, micro-optics integration, and optical-module reliability qualification.
• Experience bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Nice to have

• Experience with automated optical/electro-optical test setups, motion-control systems, and Python-based tools.
• Knowledge of co-packaged optics, pluggable modules, silicon photonics ecosystems, and advanced SiPh packaging.
• Experience with thermal/mechanical modeling and optical simulation tools such as Lumerical and COMSOL.
• Familiarity with the GF Fotonix platform and 300mm monolithic silicon photonics integration.
• Experience leading cross-functional teams and managing external development partners.

Culture & Benefits

• Work involves collaboration across photonics, electrical, mechanical, and manufacturing teams.
• Regular interaction with internal stakeholders, OSATs, external development partners, and manufacturing sites.
• Safety and Environmental, Health, Safety & Security requirements are part of the role.
• Employment is subject to applicable pre-employment conditions and laws.