Senior SoC Chiplet Architect (Chiplet Architecture)

Location: Hybrid work model with on-site and off-site work at hirify.global sites in Santa Clara, California; Phoenix, Arizona; Folsom, California; Fort Collins, Colorado; Hillsboro, Oregon; or Austin, Texas, United States

Annual salary: $164,470–$269,100 USD

Company

hirify.global develops semiconductor and computing technologies, including high-performance networking silicon for data centers, cloud infrastructure, and AI workloads.

What you will do

• Define multi-generation chiplet-based SoC architecture strategies, roadmaps, and monolithic-versus-chiplet decision frameworks.
• Lead functional partitioning across compute, networking and I/O, accelerators, memory controllers, security, and management chiplets.
• Architect die-to-die interconnects, bandwidth and latency requirements, reliability mechanisms, flow control, and inter-chiplet QoS.
• Define power, clock, reset, boot, firmware, telemetry, debug, observability, RAS, and security infrastructure across multi-die systems.
• Lead quantitative trade studies covering performance, power, area, cost, yield, schedule, packaging overhead, and product flexibility.
• Align architecture, RTL, design verification, firmware, software, packaging, manufacturing, and platform teams on technical decisions.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• 7+ years of experience in SoC or system architecture, from requirements definition through silicon execution.
• Experience with multi-die or chiplet partitioning and related D2D, boot/reset, cross-domain QoS, and debug implications.
• Experience leading architecture trade-off studies and communicating decisions to senior technical and business stakeholders.
• Understanding of interconnects and fabrics, memory subsystem behavior, performance modeling, and PPA tradeoffs.

Nice to have

• Familiarity with chiplet interoperability standards and ecosystem discussions.
• Hands-on experience with system bring-up and architecture-driven debug and telemetry planning.
• Experience building or using cost and yield models for architectural decisions.

Culture & Benefits

• Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
• Competitive annual compensation, stock bonuses, health benefits, retirement programs, and vacation.
• Opportunity to work across architecture, packaging, manufacturing, firmware, software, and platform organizations.
• Experienced-hire position on a team developing networking platforms for hyperscale data centers, cloud infrastructure, and AI workloads.