Low Yield Analysis Engineer on Shift (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States. Shift 5 schedule; flexibility with working hours is required.

Annual salary: $99,030–$139,810 USD

Company

hirify.global develops and manufactures semiconductor technologies, including integrated circuit and package assembly solutions.

What you will do

• Analyze wafer-level assembly, package assembly, sort, and test failures to determine root causes of yield loss and in-line electrical failures.
• Design, test, check out, modify, and characterize wafer-level assembly technologies and semiconductor packages.
• Conduct hands-on laboratory work, define data acquisition strategies and analysis plans, and recommend corrective actions.
• Develop failure-analysis techniques, best-known methods, and approaches to accelerate failure identification.
• Support package design, development, sustaining activities, and manufacturing process improvements.
• Collaborate with engineering technicians, module partners, yield and integration teams, suppliers, and internal and external customers.

Requirements

• Master’s degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• At least one year of laboratory experience.
• Experience with defect characterization or electrical fault isolation techniques through work, education, internships, or military training.
• Strong analytical, problem-solving, communication, and presentation skills.
• Ability to work effectively across organizational boundaries and in an ambiguous, fast-paced technical environment.
• This is a lab-based, on-site role in the United States and is not eligible for hirify.global immigration sponsorship.

Nice to have

• Experience with cross-sectioning, delayering, SEM, X-ray, microscopy, CSAM, ion milling, TEM, or FIB.
• Experience with electrical fault isolation and failure-analysis tools such as hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, or ELITE.
• Experience with EDX, AFM, FTIR, Raman, XRD, or EBSD techniques.
• Knowledge of package or die mapping software, SQL scripting, and statistical analysis tools such as JMP.

Culture & Benefits

• Collaborative work with engineering teams, technicians, suppliers, and customers.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Inclusive employment practices and consideration for qualified applicants regardless of legally protected characteristics.