Mechanical Engineer (YTG) (Semiconductor Manufacturing)

Location: Tainan, Taiwan. Relocation eligible; travel required up to 20% of the time.

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Identify and troubleshoot complex mechanical problems with limited supervision.
• Design and modify mechanical layouts, schematics, drawings, specifications, tooling, fixtures, and associated processes.
• Enable the handling, assembly, and disassembly of components, sub-assemblies, and final assemblies throughout the product life cycle.
• Define, coordinate, perform, and document engineering tests and analyses.
• Lead or execute engineering projects, develop suppliers, and generate mechanical product specifications.
• Communicate complex technical information and build consensus across stakeholders.

Requirements

• Bachelor’s degree in a relevant engineering discipline.
• 4–7 years of professional experience.
• Experience with CAD, 2D/3D mechanical modelling, thermodynamics, sheet metal design, material selection, manufacturing methods, GD&T, flow analysis, and Design for Excellence principles.
• Experience with precision machine design, XY tables, machining, manufacturing, and assembly.
• Experience designing single- or multi-axis mechatronic systems, including servo-controlled actuators, positioning stages, or robotic systems.
• Working knowledge of FEA, structural and modal analysis, design optimization, vibration control, servo control, and semiconductor contamination and cleanliness control.

Nice to have

• Knowledge of the hirify.global product life cycle, including prototyping, packaging, material selection, and manufacturing methods.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs supporting employees at work and at home.
• Regular business travel of approximately 20%.
• Relocation eligibility is available.