Module Process Engineer V (Epitaxy)

Location: Austin, TX; Boise, ID; Dallas-Richardson, TX; Hillsboro, OR; Phoenix, AZ; or Santa Clara, CA. Travel required up to 25% of the time. Relocation eligible.

Salary: $140,000–$192,500 per year

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Lead complex epitaxy process and equipment engineering initiatives in wafer fabrication environments.
• Analyze process, yield, and integration data to troubleshoot complex problems and identify root causes.
• Lead customer discussions, identify high-value problems, and propose continuous improvement projects.
• Improve defects, variability, cost of ownership, preventive maintenance, process Cpk, matching, and output.
• Demonstrate and drive adoption of service technologies through customer-site evaluations, demonstrations, and joint development programs.
• Prepare technical reports, present findings to customers, and mentor junior Module Process Engineers.

Requirements

• BS or MS degree in Engineering.
• 10+ years of experience in epitaxy process or equipment engineering.
• Strong wafer fab process and equipment experience.
• Technical expertise in EPI unit processes and wafer fab operations.
• Advanced process integration knowledge and knowledge of at least four processes across two or more technologies.
• Ability to communicate complex ideas, anticipate objections, and influence senior stakeholders.

Culture & Benefits

• Supportive environment focused on learning, professional development, and career growth.
• Comprehensive benefits package with programs supporting employee health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Equal opportunity employment and accessibility support.