Module Engineer (Semiconductors)

TL;DR

Module Engineer (Semiconductors): Driving innovation in semiconductor manufacturing from feasibility to high-volume production with an accent on optimizing manufacturing processes, equipment, and systems. Focus on designing test programs, resolving yield issues, and leading technology transfer initiatives to global sites.

Location: On-site in Hillsboro, Oregon, US (at least 4 days per week)

Salary: $144,253 - $170,630 USD

Company

hirify.global is a global leader in semiconductor technology, focusing on the development of cutting-edge integrated circuits and advanced packaging.

What you will do

• Lead the development and optimization of manufacturing processes and equipment for high-volume production.
• Conduct feasibility studies and theoretical simulations for innovative device architectures.
• Design and validate test programs to ensure integrated circuits meet performance specifications.
• Implement equipment modifications to optimize safety, quality, cost, productivity, and yield.
• Collaborate with suppliers to design critical technology enablement elements and refine process requirements.
• Analyze performance data and resolve yield issues through systematic troubleshooting and root cause analysis.

Requirements

• Doctorate degree (PhD) in Material Science, Electrical, Mechanical, or Chemical Engineering, or another STEM-related field.
• Must be able to work on-site in Hillsboro, Oregon, at least 4 days per week in accordance with company policy.

Culture & Benefits

• Total compensation package including competitive pay and stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Opportunity to work at the forefront of semiconductor technology in a global leadership environment.