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Principal Engineer, Module Development (CMP)

211 400 - 298 440$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Engineer, Module Development (CMP) (Semiconductor Manufacturing/CMP): Leading CMP process development and manufacturing readiness across advanced logic technology nodes with an accent on process optimization, defect reduction, yield improvement, and process integration. Focus on solving complex manufacturing issues, aligning CMP performance across development and high-volume manufacturing, and co-developing processes with equipment and materials suppliers.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $211,400–$298,440 USD

Company

hirify.global develops and manufactures advanced semiconductor technologies and operates hirify.global Foundry Technology Manufacturing for internal and external customers.

What you will do

  • Lead CMP module development strategy and execution across multiple advanced technology nodes, including 18A, hirify.global 3, and hirify.global 12nm.
  • Own technical direction for CMP process optimization, qualification, process control, and high-volume manufacturing readiness.
  • Drive defect reduction, yield improvement, variability reduction, and process stabilization initiatives.
  • Resolve complex technical and manufacturing issues with integration, device, yield, defect metrology, quality, reliability, factory, customer engineering, and supplier teams.
  • Co-develop and optimize CMP processes, equipment, consumables, and materials with internal and external stakeholders.
  • Mentor junior engineers, communicate technical recommendations to leadership, and serve as a CMP technical focal point.

Requirements

  • Experience in Chemical Mechanical Planarization (CMP) process development and optimization.
  • At least 10 years of direct CMP process development and optimization experience, including hands-on process tuning and characterization.
  • 15+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
  • Experience with CMP equipment and consumables, including at least one major CMP tool platform and associated materials or components.
  • Master’s degree in chemical engineering, materials science, electrical engineering, mechanical engineering, physics, or a related engineering or science field; PhD preferred.
  • Strong data-driven root-cause analysis skills and working knowledge of process integration, module interactions, process control, and metrology.

Nice to have

  • Experience with sub-10nm logic and Gate-All-Around (GAA) technologies.
  • Semiconductor foundry experience and success delivering solutions in technology development and high-volume manufacturing.
  • Experience collaborating with equipment and material suppliers to tune CMP processes.
  • Cross-functional leadership across site teams, yield excursions, defect reduction, and technology ramp efforts.

Culture & Benefits

  • Full-time employment with an on-site Shift 1 work model.
  • Compensation package including competitive pay, stock bonuses, health benefits, retirement programs, and vacation.
  • Commitment to safety, quality, compliance, responsible business practices, and ethical hiring.
  • This is a Position of Trust requiring consent to and successful completion of an extended background investigation.

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