Director, Module Process Engineer (ETCH/Thin Flim)

Location: Icheon-Gwango, South Korea

Company

hirify.global develops materials engineering solutions, equipment, and services for semiconductor and advanced display manufacturing.

What you will do

• Engage with customers to understand technology roadmaps, identify high-value problems, and discover service opportunities.
• Introduce and adapt new AGS service solutions for customer needs.
• Collaborate with service business and service product development teams on product development, customer transfer, and on-site optimization.
• Act as the liaison between customers and internal service teams to deliver applicable solutions.
• Work with customers and the FSO team to meet CSA performance KPIs.
• Resolve complex equipment issues using systematic troubleshooting, DOEs, FDC, analytics, and metrology, and share learnings globally.

Requirements

• Expertise in etch or thin film hardware and processes.
• Advanced knowledge of process integration, FDC, data analytics, and metrology.
• Recognized technical expertise in a specialized engineering field and broad knowledge of related disciplines.
• Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or Chemistry.
• Ability to lead others in solving complex problems and communicate difficult technical concepts.
• Relocation is not eligible for this position.

Nice to have

• Advanced integration knowledge.
• Advanced degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or Chemistry.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Opportunities to work on innovative semiconductor and display technologies.
• Employee health and wellbeing programs supporting personal and professional development.
• Regular full-time employment with travel requirements determined by the role.