EPG Manufacturing Engineer II - (E2) (Semiconductor Manufacturing)

Location: Tainan, Taiwan

Company

Materials engineering company designing, building, and servicing equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Apply technical knowledge of EPG 200mm products and structures to support manufacturing operations.
• Solve technical challenges affecting stable, high-volume manufacturing and drive design improvements for product reliability.
• Ramp up manufacturing capabilities for module building, integration, and testing with cross-functional teams.
• Use manufacturing drawings and 3D modeling tools to improve manufacturability, product quality, and costs.
• Determine time standards, tooling needs, and process requirements.
• Identify root causes and corrective actions for assembly and system-testing issues, and maintain manufacturing and material specifications.

Requirements

• Bachelor’s degree.
• 2–4 years of engineering experience in the semiconductor industry.
• Experience with Microsoft Office, SAP, and Engineering Change Orders.
• Ability to read and understand manufacturing drawings.
• Technical experience with EPG 200mm products and structures.
• Ability to work in clean-room environments and perform physical activities including standing, walking, lifting, and using hand and power tools.

Nice to have

• hirify.global hardware expertise.
• Experience with MDP and ETCH tools.
• Experience with DFx, SolidWorks, NX, AutoCAD, or Inventor.
• Strong problem-solving, interpersonal, and communication skills.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs supporting employees at work and at home.
• Regular travel required for approximately 20% of working time.
• Personal protective equipment is required when working in clean-room environments.
• Regular employment position; relocation eligibility is not available.