Applications Engineer (Semiconductor 3D X-ray Solutions)

Location: Benicia, CA, United States. Onsite role with up to 25–30% domestic and international travel. Relocation eligible.

Salary: $108,000–$148,500 per year, plus potential bonus and stock award programs.

Company

hirify.global develops materials science and engineering solutions and semiconductor equipment used in chip and advanced display manufacturing.

What you will do

• Lead system demonstrations, evaluations, beta-site activities, customer trials, technical presentations, and review meetings for semiconductor customers, including fabs, failure-analysis laboratories, and R&D centers.
• Develop and transfer new applications, methodologies, and capabilities for semiconductor inspection, metrology, failure analysis, devices, processes, and packaging technologies.
• Design and optimize robust workflows for semiconductor inspection and analysis, including data acquisition and analysis workflows.
• Perform tool characterization, benchmarking, baseline performance studies, and system-performance optimization.
• Provide customer and internal product-development input on technical requirements, system specifications, application gaps, support plans, and implementation schedules.
• Author technical papers, present at conferences, support trade shows, and act as the technical interface between customers, engineering, sales, and marketing.

Requirements

• BS or MS degree in Materials Science, Physics, Electrical Engineering, or a related technical field.
• 3–5 years of experience in a semiconductor-related field, such as fabs, failure analysis, metrology, or process development.
• Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment.
• Ability and willingness to travel up to 30% domestically and internationally.
• Conceptual and practical expertise in the relevant discipline and basic knowledge of related disciplines.
• Knowledge of best practices, competitive factors, and how the discipline integrates with related areas.
• Ability to solve complex problems using analysis of multiple information sources, explain difficult information, build consensus, and lead small projects or support colleagues with less experience.

Nice to have

• Background in microscopy or advanced imaging techniques, including X-ray CT, SEM, or FIB.
• Working knowledge of X-ray absorption principles and imaging or optical fundamentals.
• Experience with semiconductor capital equipment, especially inspection, metrology, or failure-analysis workflows.
• Familiarity with 3D IC, heterogeneous integration, and advanced packaging technologies.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Equal opportunity employment and accessibility support for the application process.