обновлено 1 час назад
Senior Applications Engineer (Semiconductor 3D X-ray Solutions)
108 000 - 148 500$
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Описание вакансии
Текст:
TL;DR
Senior Applications Engineer (Semiconductor 3D X-ray Solutions): Developing and deploying 3D X-ray inspection, metrology, and failure-analysis workflows for semiconductor fabs, laboratories, and R&D centers with an accent on customer applications, system characterization, and advanced packaging. Focus on designing experiments, optimizing imaging methodologies, translating customer needs into product specifications, and solving yield, reliability, and process-development challenges.
Location: Benicia, California, United States
Salary: $108,000–$148,500 per year, plus potential bonus and stock award compensation.
Company
develops and services materials engineering equipment used to manufacture semiconductors and advanced displays.
What you will do
- Lead system demonstrations, evaluations, beta-site activities, and technical reviews for semiconductor fabs, failure-analysis laboratories, and R&D centers.
- Develop and optimize 3D X-ray inspection, metrology, and failure-analysis workflows for semiconductor devices, processes, and packaging technologies.
- Characterize tools, benchmark performance, design experiments, analyze data, and establish baseline performance studies.
- Identify application gaps and transfer new application capabilities from product divisions to customer application-support teams.
- Provide input to product development and system specifications based on customer requirements and application needs.
- Deliver advanced customer training, technical presentations, demonstrations, conference support, and technical publications.
Requirements
- Bachelor’s or master’s degree in materials science, physics, electrical engineering, or a related technical discipline.
- 3–5 years of experience in a semiconductor-related field, such as fabs, failure analysis, metrology, or process development.
- Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment.
- Ability to technically lead complex application activities, solve complex problems, and build consensus with customers and internal teams.
- Ability and willingness to travel up to 30% domestically and internationally.
Nice to have
- Experience with microscopy or advanced imaging techniques, including X-ray CT, SEM, or FIB.
- Working knowledge of X-ray absorption principles and imaging or optical fundamentals.
- Experience with semiconductor capital equipment and inspection, metrology, or failure-analysis workflows.
- Familiarity with 3D ICs, heterogeneous integration, and advanced semiconductor packaging.
Culture & Benefits
- Supportive environment focused on learning, professional development, and technical growth.
- Comprehensive employee benefits supporting health and wellbeing.
- Regular customer-facing work with scientists, engineers, research professionals, and semiconductor industry organizations.
- Relocation is not available for this position.
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