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2 дня назад

Advanced Packaging Lithography Development Manager

155 520 - 298 440$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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TL;DR

Advanced Packaging Lithography Development Manager (Semiconductor): Leading lithography development for next-generation packaging solutions with an accent on Foveros Direct technologies and process optimization. Focus on managing engineering teams, driving yield improvement initiatives, and ensuring seamless technology transfer to high-volume manufacturing.

Location: Must be based on-site in Hillsboro, Oregon, USA

Salary: $155,520–$298,440 USD

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

  • Lead and manage a team of process engineers, fostering an innovative and productive work environment.
  • Formulate long-term process roadmap strategies to maintain leadership in advanced packaging.
  • Develop and execute project schedules, tracking milestones and deliverables across cross-functional teams.
  • Drive lithography module yield improvement and defect reduction programs.
  • Partner with manufacturing operations to ensure seamless technology transfer to high-volume production.

Requirements

  • Master or PhD degree in Physics, Electrical Engineering, Materials Science, or Mechanical Engineering.
  • 6+ years of relevant experience (Master's) or 5+ years (PhD).
  • Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) or track equipment.
  • Extensive experience in lithography process optimization and manufacturing readiness.
  • Proven project management experience, including scheduling and cross-functional collaboration.

Nice to have

  • Demonstrated ability to build and lead effective, inclusive teams.
  • Experience with vendor relations and material quality assessments.
  • Strong knowledge of Design of Experiments (DOE) and package interconnect technologies.

Culture & Benefits

  • Competitive total compensation package including pay and stock bonuses.
  • Comprehensive health and retirement benefit programs.
  • Paid vacation and time-off policies.
  • Commitment to an inclusive and innovative work environment.

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