Principal Engineer (Hybrid Bonding)

Location: On-site in Hillsboro, Oregon, USA

Salary: $211,400–$298,440 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology for the AI era.

What you will do

• Define and drive the hybrid bonding technology roadmap, including pitch scaling and reliability targets.
• Lead module-level process development for die-to-wafer hybrid bonding.
• Drive first-of-a-kind equipment and platform development from concept through high-volume manufacturing.
• Implement strategies to address bond interface defects, alignment limitations, and surface preparation challenges.
• Resolve systemic yield and reliability issues using data-driven methodologies.
• Partner with equipment and materials suppliers to influence next-generation bonding tools.

Requirements

• Must be authorized to work in the United States.
• Bachelor's degree with 15+ years of experience, Master's with 10+ years, or PhD with 8+ years in a relevant engineering field.
• Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
• Proven experience in process optimization, yield improvement, and scaling to high-volume manufacturing.
• Ability to translate technology roadmaps into executable module strategies.
• Experience mentoring and developing senior technical talent.

Culture & Benefits

• Competitive total compensation package including pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work at the forefront of semiconductor innovation and advanced packaging.
• Collaborative environment fostering technical excellence and continuous capability growth.