Principal Engineer (Hybrid Bonding)

TL;DR

Principal Engineer (Hybrid Bonding): Defining and scaling next-generation advanced packaging technologies for AI and high-performance computing with an accent on die-to-wafer hybrid bonding and high-volume manufacturing (HVM). Focus on driving first-of-a-kind platform development, solving bond interface defects, and optimizing yield and reliability for chiplet architectures.

Location: On-site in Hillsboro, Oregon, USA

Salary: $211,400 - $298,440

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology leadership for the AI era.

What you will do

• Define and drive the hybrid bonding technology roadmap, focusing on pitch scaling, alignment, and yield targets.
• Lead module-level process development for die-to-wafer hybrid bonding across adjacent process steps.
• Drive first-of-a-kind (FOK) equipment development from concept through implementation.
• Address critical challenges like bond interface defects, contamination control, and overlay limitations.
• Partner with external equipment vendors and materials suppliers to influence next-gen bonding tools.
• Mentor and develop technical leaders and domain experts within the organization.

Requirements

• Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
• Proven experience scaling FOK platforms to high-volume manufacturing (HVM).
• Degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
• Experience: Bachelor's + 15+ years, Master's + 10+ years, or PhD + 8+ years.
• Strong communication and decision-making skills to align technical vision with organizational goals.

Nice to have

• Track record of delivering hybrid bonding platforms into HVM.
• Experience with 2.5D/3D integration and chiplets.
• Knowledge of Cu-Cu bond interface physics and dielectric bonding.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Opportunity to work on cutting-edge silicon process and packaging for the AI era.
• Collaborative environment within a worldwide factory network.