Failure Analysis Engineer (Semiconductor)

Location: Singapore, SGP. Work location: North. Travel required 50% of the time. Relocation is not available.

Company

hirify.global develops materials engineering solutions and equipment for semiconductor and advanced display manufacturing.

What you will do

• Perform Failure Analysis and Construction Analysis for qualification, evaluation, process rejects, and RMAs, and contribute to final reports.
• Advise problem-solving and cross-functional teams on analysis methods for identifying failure mechanisms.
• Support machine readiness, tool buyoff, and capacity ramp-up for new equipment.
• Develop analysis capabilities and techniques to improve detection, productivity, and recipe optimization.
• Drive robustness, cycle-time, and cost-reduction improvements.
• Train FA staff, maintain tools and lab safety standards, support audits, and coordinate FA request systems and customer quotations.

Requirements

• Degree in Materials, Electrical, Electronics, or Mechanical Engineering, or equivalent.
• Minimum 3 years of Reliability Test and Failure Analysis experience in the semiconductor or photonic industry.
• Practical knowledge of cross-section analysis, ion milling, CSAM, EDX, FTIR, FIB, and related FA techniques.
• Knowledge of material characterization procedures, including bend, abrasion, and adhesion testing.
• Understanding of materials physics and the relationship between reliability and failure-analysis testing.
• Strong leadership, communication, interpersonal, teamwork, and self-management skills.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Collaboration with R&D, engineering, operations, vendors, suppliers, customers, and semiconductor and display technology specialists.
• Employee health and wellbeing programs supporting personal and professional growth.
• Regular travel is required for 50% of the working time.