Package Failure Analysis Engineer

TL;DR

Package Failure Analysis Engineer (Semiconductor): Supporting root cause determination of assembled package yield loss and in-line failures with an accent on electrical fault isolation and defect characterization. Focus on conducting hands-on lab work, developing innovative failure analysis techniques, and collaborating across organizational boundaries to improve manufacturing yield.

Location: On-site in Phoenix, Arizona. US Citizenship is required due to the necessity of obtaining and maintaining a US Government TS/SCI Security Clearance with Polygraph.

Salary: $85,200–$139,810 USD

Company

hirify.global Foundry is a global leader in semiconductor manufacturing, providing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Conduct hands-on lab work to perform fault isolation of electrical failures and defect characterization.
• Define data acquisition strategies and analysis plans to identify root causes of yield loss.
• Develop innovative failure analysis techniques and best-known methods (BKMs) to accelerate mechanism understanding.
• Collaborate with shift engineering technicians, module partners, and integration teams to meet program milestones.
• Provide technical consultation regarding packaging and assembly improvements.
• Respond to customer requests and events in a fast-paced manufacturing environment.

Requirements

• Bachelor's Degree or higher in Materials Science, Mechanical, Chemical, or Electrical Engineering, Physics, or Chemistry.
• US Citizenship is required.
• Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
• Hands-on experience with at least one electrical fault isolation or defect characterization technique.
• Ability to work a Shift 5 schedule (front half of the week, including Sundays).
• Strong analytical, problem-solving, and communication skills.

Nice to have

• Active US Government TS/SCI Security Clearance with Polygraph.
• Experience with optical analysis techniques (SEM, TEM, x-ray, optical microscopy).
• Knowledge of electrical circuits and probing equipment (TDR, EOTPR, EBAC, etc.).
• Familiarity with chemical compositional analysis (EDX, AFM, FTIR, XRD).
• Experience with CAD software and statistical tools like JMP.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Collaborative and inclusive work environment focused on innovation.
• Opportunities to work with state-of-the-art semiconductor manufacturing technology.