Package Failure Analysis Engineer

Location: On-site in Phoenix, Arizona, United States. Shift 5 schedule required: days on the front half of the week, AM–PM Sunday through Tuesday and alternating Wednesday days.

Annual salary: $85,200–$139,810 USD.

Company

hirify.global Foundry develops semiconductor process, packaging, manufacturing, supply chain, and final test and assembly technologies for customer products.

What you will do

• Determine root causes of assembled package yield loss and in-line failures.
• Design, test, check out, modify, and characterize assembly technologies.
• Conduct hands-on laboratory analyses and engineering tests to isolate electrical faults and characterize defects and processes.
• Define data acquisition strategies and analysis plans, then recommend corrective actions to internal customers.
• Develop innovative failure analysis techniques, best-known methods, and approaches to accelerate failure identification.
• Collaborate with shift technicians, engineers, module partners, yield and integration teams, program customers, and other internal organizations.

Requirements

• Bachelor’s degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• US citizenship is required.
• Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
• Hands-on experience with at least one electrical fault isolation or defect characterization technique.
• Strong analytical, problem-solving, communication, presentation, and collaboration skills.
• Ability to work flexibly with changing priorities, ambiguous responsibilities, and the required shift schedule.

Nice to have

• Active US Government TS/SCI Security Clearance with Polygraph.
• Laboratory experience or academic experience with laboratory equipment.
• Experience with SEM, TEM, X-ray, optical microscopy, electrical circuits, multimeters, TDR, EOTPR, EBAC, RIDR, or ELITE.
• Experience with EDX, AFM, FTIR, Raman, XRD, or EBSD analysis techniques.
• Familiarity with CAD software and statistical analysis tools such as JMP.

Culture & Benefits

• Collaborative environment spanning engineering, manufacturing, yield, integration, and program teams.
• Opportunities to contribute to semiconductor manufacturing and advanced packaging improvements.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.