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Advanced Packaging Integration Engineer (Semiconductor)

161 000 - 221 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Advanced Packaging Integration Engineer (Semiconductor): Developing production-ready advanced packaging integration flows for high-performance interconnects and micro-LED panels with an accent on hybrid bonding, 2.5D/3D heterogeneous integration, manufacturability, and reliability. Focus on designing experiments, analyzing process data, solving integration roadblocks, and collaborating with fabs, OSATs, suppliers, and cross-functional engineering teams.

Location: Santa Clara, CA; onsite at the Santa Clara headquarters. Travel required up to 10% of the time. Relocation eligible.

Salary: $161,000–$221,000 per year.

Company

hirify.global develops materials engineering solutions and semiconductor and display manufacturing equipment, including technologies supporting AI and IoT.

What you will do

  • Lead process integration for high-performance interconnects and micro-LED panels.
  • Define, develop, execute, and optimize advanced packaging integration flows, including hybrid bonding and 2.5D/3D heterogeneous integration.
  • Own complex technical projects, track progress, resolve roadblocks, and ensure on-time delivery.
  • Design experiments, collect and analyze data, perform root-cause analysis, and implement corrective actions.
  • Collaborate with foundries, OSATs, suppliers, internal research teams, and design, process, integration, and metrology groups.
  • Apply advances in the field to develop innovative, production-ready packaging solutions.

Requirements

  • Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
  • In-depth knowledge and hands-on experience with advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
  • Strong communication and interpersonal skills, with the ability to collaborate across multidisciplinary teams.
  • Proficiency in statistical data analysis, process optimization, and process control techniques such as Design of Experiments, SPC, and JMP.
  • Strong problem-solving skills and the ability to work independently and in teams with minimal supervision.

Nice to have

  • Micro-LED or CPO experience.
  • Coding capability.
  • Experience with MES systems.
  • Ability to prepare clear, compelling executive-level or customer-facing presentations.

Culture & Benefits

  • Supportive work culture focused on learning, development, and career growth.
  • Comprehensive benefits package supporting employee health and wellbeing.
  • Additional compensation may include bonus and stock awards, as applicable.
  • Regular employment with full-time status.

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