statistical analysisspcjmpdesign of experiments3d integrationadvanced packagingsemiconductor processinghybrid bondingmicro led2.5d integration
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Средняя
$161к-221к/год
$180к$190кмедиана$220к
По похожим ролям (50) ~ $190к/год
На СНГ рынке: $3к/мес ($2.9к - $3к)
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Крутая вакансия
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Высокоуровневая роль в мировом лидере по производству полупроводников с отличной зарплатой и работой над передовыми технологиями упаковки, которые сейчас критичны для развития AI.
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КомандировкиТрендовый доменДостойная оплатаПередовой стекПрозрачные задачи
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Advanced Packaging Integration Engineer (Semiconductor): Developing production-ready advanced packaging integration flows for high-performance interconnects and micro-LED panels with an accent on hybrid bonding, 2.5D/3D heterogeneous integration, manufacturability, and reliability. Focus on designing experiments, analyzing process data, solving integration roadblocks, and collaborating with fabs, OSATs, suppliers, and cross-functional engineering teams.
Location: Santa Clara, CA; onsite at the Santa Clara headquarters. Travel required up to 10% of the time. Relocation eligible.
Salary: $161,000–$221,000 per year.
Company
hirify.global develops materials engineering solutions and semiconductor and display manufacturing equipment, including technologies supporting AI and IoT.
What you will do
Lead process integration for high-performance interconnects and micro-LED panels.
Define, develop, execute, and optimize advanced packaging integration flows, including hybrid bonding and 2.5D/3D heterogeneous integration.
Own complex technical projects, track progress, resolve roadblocks, and ensure on-time delivery.
Design experiments, collect and analyze data, perform root-cause analysis, and implement corrective actions.
Collaborate with foundries, OSATs, suppliers, internal research teams, and design, process, integration, and metrology groups.
Apply advances in the field to develop innovative, production-ready packaging solutions.
Requirements
Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
In-depth knowledge and hands-on experience with advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
Strong communication and interpersonal skills, with the ability to collaborate across multidisciplinary teams.
Proficiency in statistical data analysis, process optimization, and process control techniques such as Design of Experiments, SPC, and JMP.
Strong problem-solving skills and the ability to work independently and in teams with minimal supervision.
Nice to have
Micro-LED or CPO experience.
Coding capability.
Experience with MES systems.
Ability to prepare clear, compelling executive-level or customer-facing presentations.
Culture & Benefits
Supportive work culture focused on learning, development, and career growth.
Comprehensive benefits package supporting employee health and wellbeing.
Additional compensation may include bonus and stock awards, as applicable.
Regular employment with full-time status.
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