Sort Interface Pathfinding and Development Engineer (Advanced Packaging)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $133,800–$255,200 USD

Company

hirify.global develops semiconductor, computing, connectivity, and artificial hirify.globalligence technologies. The Advanced Packaging, Test and Manufacturing organization delivers packaging and test technologies for Client, Data Center, AI, Networking, and External Foundry markets.

What you will do

• Develop silicon interface probing and test solutions for wafer and die sort across advanced process nodes and heterogeneous packaging platforms including EMIB, EMIB-T, Foveros, and Foveros Direct.
• Formulate and execute Design of Experiments to optimize and qualify probing technologies, contact architectures, probing margins, yield, and process health.
• Translate chiplet and package requirements from Foundry and OSAT customers into scalable sort interface specifications.
• Create sort design rules and Interface Design Kits for external fabless customers and design partners.
• Architect test interface hardware with customer design and DFT teams and resolve technical gaps.
• Coordinate global test solution vendors and PCB suppliers, drive supplier accountability, and support manufacturing readiness for New Product Introductions.

Requirements

• Bachelor’s degree in electrical engineering, mechanical engineering, materials science, or a related STEM field with 6+ years of industry experience, or a master’s degree with 4+ years of industry experience, or a Ph.D. with 2+ years of relevant post-graduate or industry experience.
• Experience with wafer or die sort technology, prober-tester cell integration, and qualification of advanced probe card technologies.
• Experience structuring and executing Design of Experiments to evaluate probing margins, yield, and process health.
• Direct experience in ATE test hardware or methodology, Sort/Class product development, or PCB, space transformer, or substrate design rules and stackup architectures.
• Collaborative communication skills for working with cross-functional teams, customers, and global suppliers.
• Ability to translate complex technical concepts into clear, actionable specifications and make data-driven decisions in an evolving environment.

Nice to have

• 6+ years of experience in advanced probing process characterization.
• Experience managing technical relationships with external probe card or substrate suppliers or supporting external Foundry and OSAT customers with test hardware applications.
• Knowledge of OSAT and Foundry test operations, multi-client test cell standards, customer design collateral, PDK enablement, or turnkey test delivery models.
• Experience qualifying probe technologies for fine-pitch micro-bumps, 2.5D/3D architectures, EMIB, EMIB-T, silicon bridges, or wafer-level chip-scale probing.
• Hands-on experience with Advantest V93k or Teradyne Ultra-FLEX ATE platforms.

Culture & Benefits

• Full-time, experienced-hire position with on-site work required.
• Competitive annual compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Work involves collaboration with customers, suppliers, and global cross-functional teams.