Advanced Packaging Modeling Engineer (Semiconductor)

Location: Malta, New York, USA; onsite role at a 300mm fabrication facility.

Salary: $98,000–$176,000 per year; the exact salary depends on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services to technology companies through a global manufacturing footprint.

What you will do

• Address 3DHI and advanced packaging questions across logic, RF, analog, and memory technologies.
• Use commercial modeling and simulation software to guide device, integration, and packaging optimizations for mechanical, thermal, and electrical performance.
• Perform stress simulations for continuous and discontinuous active areas and evaluate how stress affects device performance.
• Anticipate integration and process issues using information from integration, process, and design enablement teams together with modeling results.
• Identify simulations that highlight critical process interactions and support 3DHI technology decisions.
• Collaborate extensively with integration, device, and design engineers to develop working technology while following Environmental, Health, Safety & Security requirements.

Requirements

• Either an M.S. with at least 5 years of relevant experience, or a PhD with at least 3 years of relevant experience.
• Experience with semiconductor mechanical, thermal, or electrical simulation tools, including Ansys Mechanical Workbench or other applicable software.
• Overall GPA of at least 3.0 and proven good academic standing.
• English fluency in written and verbal communication.
• Solid understanding of semiconductor processes and integration techniques.
• Good computer and software skills.
• Ability to clearly present results to small and large groups.

Nice to have

• PhD with 5 years of relevant experience.
• Thermal and electrical simulation experience for specific IC circuit designs, preferably with RF analog experience, plus experience with LVS and DRC verification tools such as Cadence, Mentor Graphics, or Keysight ADS.
• Experience working in environments requiring strong attention to detail and timeliness.
• Prior leadership experience in the workplace, school projects, competitions, or similar settings.
• Project management skills, including the ability to innovate, execute meaningful solutions, and navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Culture & Benefits

• Full-time employment at a semiconductor manufacturing facility.
• Commitment to workplace equal opportunity and cultural diversity.
• Employment is subject to successful completion of applicable pre-employment conditions.
• Reasonable accommodations are available during the employment process upon request.