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5 дней назад

Oregon Advanced Packaging Module Engineer (Laser)

89 010 - 125 660$
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Oregon Advanced Packaging Module Engineer (Laser) (semiconductor manufacturing): Owning high-volume wafer packaging equipment and processes for advanced semiconductor manufacturing with an accent on laser processing, process control, metrology, and technology transfer. Focus on preventing process excursions, qualifying equipment during factory ramps, optimizing tool configurations, and driving continuous improvement in safety, quality, productivity, and defect reduction.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $89,010–$125,660 USD

Company

hirify.global develops advanced semiconductor manufacturing technologies and packaging solutions for high-volume global production.

What you will do

  • Own high-volume advanced packaging equipment and processes supporting manufacturability of hirify.global and external products.
  • Perform NPI, process development, process optimization, and inline metrology for process control.
  • Develop and monitor excursion-prevention and discrepant-material detection systems for equipment modules.
  • Partner with global manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
  • Lead initiatives for safety, quality, productivity, cost reduction, and systematic defect reduction.
  • Coordinate equipment installations, conversions, qualifications, and supplier collaboration during factory ramps.

Requirements

  • Bachelor’s degree in Electrical Engineering, Physics, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, or a related STEM field, plus 1+ year of hands-on experience in semiconductor manufacturing or high-tech process equipment; or a master’s degree in a matching STEM discipline.
  • Relevant experience in laser processing or process development, including experience gained through internships, academic projects, coursework, or hands-on technical training.
  • Technical leadership, cross-functional collaboration, analytical problem-solving, and the ability to diagnose complex electromechanical and process issues using structured data.
  • Ability to work in a rapidly changing, fast-paced, high-volume manufacturing environment with strong attention to precision, safety, and design-to-target compliance.

Nice to have

  • 6+ months of experience with technical documentation, cleanrooms, wafer-level packaging, semiconductor singulation, or troubleshooting equipment and analytical instruments in a semiconductor environment.
  • Experience using statistical analysis tools such as JMP or SQL.

Culture & Benefits

  • On-site work supporting hirify.global’s Aloha and Ronler factories in Oregon.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.
  • Opportunities to work with global manufacturing sites and advanced semiconductor technologies.

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