Advanced Packaging Dry Etch Module Development Engineer

TL;DR

Advanced Packaging Dry Etch Module Development Engineer (Semiconductor Manufacturing): Developing and optimizing plasma etch processes for next-generation semiconductor packaging technologies with an accent on 2.5D/3D integration and chiplet packaging. Focus on designing experiments (DOE), driving technology roadmaps, and collaborating with equipment suppliers to enhance manufacturing yield and efficiency.

Location: Must be based in Hillsboro, Oregon (On-site)

Salary: $133,800–$255,200 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and packaging technology for the AI era.

What you will do

• Develop and optimize plasma etch processes for advanced packaging applications.
• Design and execute experiments (DOE) to characterize process windows and improve performance.
• Partner with equipment suppliers to test and implement innovative process solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques.
• Drive technology roadmaps to meet future manufacturing requirements.
• Collaborate cross-functionally to develop scalable and robust manufacturing solutions.

Requirements

• Master's degree with 4+ years of experience or PhD with 2+ years of experience in Materials Science, Mechanical, Chemical, Electrical Engineering, Chemistry, or Physics.
• Proven experience in process development engineering within semiconductor manufacturing.
• Proficiency in Design of Experiments (DOE) and statistical process control.
• Hands-on experience with plasma etch equipment platforms.
• Must be able to work on-site in Hillsboro, Oregon.

Nice to have

• Experience in wafer-level assembly or related advanced packaging technologies.
• Demonstrated success in leading programs from strategy to high-volume production.
• Strong technical leadership in solving complex engineering challenges.

Culture & Benefits

• Competitive compensation package including base pay and stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and time-off policies.
• Opportunity to work on world-changing technologies at a global scale.