обновлено 6 дней назад
Advanced Packaging Dry Etch Module Development Engineer (Semiconductor Manufacturing)
133 800 - 255 200$
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Advanced Packaging Dry Etch Module Development Engineer (Semiconductor Manufacturing): Developing and optimizing plasma etch processes for next-generation 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions with an accent on process-window characterization, manufacturing scalability, and production yield. Focus on designing experiments, partnering with equipment suppliers, improving equipment performance, and implementing robust high-volume manufacturing solutions.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $133,800–$255,200 USD
Company
develops semiconductor technologies and advanced manufacturing solutions, including next-generation packaging technologies.
What you will do
- Develop, optimize, and implement plasma dry etch processes for advanced semiconductor packaging.
- Design experiments to characterize process windows and improve etch performance.
- Develop technology roadmaps for future manufacturing requirements and industry-leading process solutions.
- Partner with equipment suppliers to design, test, and implement innovative etch solutions.
- Optimize production efficiency, yield, equipment performance, cost, and manufacturing output.
- Collaborate with yield, operations, and other engineering functions to deliver scalable manufacturing solutions.
Requirements
- Master’s or PhD degree in materials science and engineering, mechanical engineering, chemical engineering, electrical engineering, chemistry, physics, or a related field.
- At least 4 years of experience with a master’s degree or at least 2 years with a PhD.
- Experience in semiconductor process development, including wafer-level assembly or advanced packaging.
- Experience with Design of Experiments, process development methodology, statistical process control, or manufacturing process improvement.
- Experience with plasma etch equipment platforms.
- On-site work in Hillsboro, Oregon, United States is required.
Nice to have
- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Experience leading programs from strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges.
- Cross-functional collaboration with yield, operations, and other functional stakeholders.
Culture & Benefits
- Full-time experienced-hire position with Shift 1 scheduling.
- Competitive annual compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Focus on responsible business practices and ethical hiring.
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