Principal Engineer (Advanced Packaging)

Location: Must be based in Chandler, AZ

Salary: $168,400–$249,310 per annum

Company

hirify.global is a leading semiconductor company providing essential data infrastructure solutions for cloud, AI, and enterprise architectures.

What you will do

• Develop packaging technology roadmaps for AI XPU and switch products.
• Define package architecture including chiplet topology, substrate scaling, and power delivery strategies.
• Lead co-design efforts across silicon design, floorplanning, and mechanical/thermal reliability.
• Perform signal and power integrity simulations to optimize design performance.
• Collaborate with OSATs and foundry partners to ensure manufacturability, yield, and qualification.
• Create and protect intellectual property through innovative package technology concepts.

Requirements

• Must be eligible to access export-controlled information under U.S. law.
• Bachelor’s or Master’s degree in mechanical engineering, material science, or related fields with 8-10 years of experience, or PhD with 5+ years.
• Deep expertise in advanced package and substrate technologies, including process, materials, and reliability.
• Proficiency in signal and power integrity simulation tools such as Cadence Sigrity, Ansys SIwave, and Ansys HFSS.
• Experience with 2.5D/3D package technologies like CoWoS, EMIB, CPO, or CPC.
• Strong communication skills and ability to manage cross-functional programs across global time zones.

Culture & Benefits

• Comprehensive financial well-being programs including employee stock purchase plans.
• Robust mental and physical health resources.
• Family support programs to assist with work-life balance.
• Recognition and service awards for professional milestones.
• Commitment to inclusive hiring practices and equal opportunity employment.