2 дня назад
Global Product Support (GPS) Engineer - Advanced Packaging (Semiconductor Manufacturing)
124 000 - 171 000$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Global Product Support (GPS) Engineer - Advanced Packaging (Semiconductor Manufacturing): Supporting installation, startup, qualification, and ongoing operation of the Kinex Hybrid Bonding platform for advanced packaging development with an accent on equipment integration, facilities coordination, and semiconductor manufacturing support. Focus on troubleshooting complex mechanical, electrical, automation, and process issues, coordinating vendors and product engineering teams, and enabling wafer-to-wafer and die-to-wafer bonding development.
Location: Santa Clara, CA, United States. Relocation eligible; travel required up to 10% of the time.
Salary: $124,000–$171,000 per year
Company
develops and services materials engineering equipment used to manufacture semiconductor and advanced display chips.
What you will do
- Support Kinex Hybrid Bonding platform installation from tool dock through release to engineering users.
- Coordinate startup, factory acceptance, site acceptance, qualification, and installation punch-list closure.
- Define and validate tool utility requirements and coordinate facilities, EHS, infrastructure, and hookup activities.
- Troubleshoot mechanical, electrical, automation, and process-related issues; improve uptime and equipment reliability.
- Coordinate technical reviews, service activities, upgrades, engineering changes, and issue escalations with BESI and product engineering teams.
- Support hybrid bonding, wafer-to-wafer, die-to-wafer, module integration, and experimental hardware development with CTO process engineers and researchers.
Requirements
- BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering, or a related engineering discipline.
- 3–7 years of engineering experience with semiconductor equipment; new college graduates are not considered.
- Experience supporting semiconductor manufacturing or development equipment.
- Strong troubleshooting and root-cause analysis skills.
- Excellent verbal and written communication skills.
- Ability to work across facilities, vendors, process engineering, and operations teams.
Nice to have
- Experience with advanced packaging, hybrid bonding, wafer bonding, die attach, packaging, assembly, wet clean, or semiconductor equipment.
- Experience with equipment installation and startup, facilities hookup, utility integration, vendor coordination, or BESI equipment.
- Knowledge of automated material handling, vacuum, plasma processing, wet processing, or metrology systems.
- Experience with 300 mm equipment, cleanroom construction, tool installation, or project management.
Culture & Benefits
- Supportive work culture focused on learning, development, and career growth.
- Comprehensive benefits package supporting employee health and wellbeing.
- Potential eligibility for bonus and stock award programs.
- Regular employment with full-time status.
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