Advanced Packaging Manufacturing Manager (Advanced Packaging)

Location: On-site in Phoenix, Arizona, United States; compressed work-week shifts or escalation coverage may be required.

Annual salary: $164,100–$231,670 USD.

Company

hirify.global develops semiconductor technologies and advanced substrate packaging solutions for its foundry and technology businesses.

What you will do

• Own advanced packaging manufacturing deliverables across assigned factory areas, including safety, quality, output, cost, cycle time, staffing, tool readiness, WIP movement, and schedule execution.
• Develop resource, capacity, and prioritization strategies to improve equipment availability, throughput, factory stability, and production readiness.
• Partner with engineering, integration, maintenance, planning, quality, and program teams to resolve manufacturing issues and deliver technology development milestones.
• Coordinate priorities during equipment downtime, excursions, escalations, non-standard operations, and factory recovery events.
• Strengthen standard work, training inputs, workforce coverage, shift handoffs, tool utilization, and readiness for factory ramps and equipment qualification.
• Drive continuous improvement using Lean Manufacturing, MBPS, Six Sigma, root cause analysis, data analytics, and factory performance metrics.

Requirements

• Bachelor’s degree in Engineering, Manufacturing, Operations, or a related STEM field with 6+ years of experience; or a master’s degree with 4+ years; or a PhD with 2+ years.
• Experience driving manufacturing execution, factory readiness, equipment performance, process improvement, or technical deliverables from development through high-volume manufacturing.
• Experience managing safety, quality, output, cost, cycle time, staffing, training, equipment availability, and schedule execution metrics.
• Experience with Lean Manufacturing, MBPS, Six Sigma, root cause analysis, or equivalent operational excellence methods.
• Experience leading cross-functional groups and influencing highly technical stakeholders without direct people-management authority.
• Ability to maintain a visible manufacturing-floor presence and support compressed work-week shifts or escalation coverage.

Nice to have

• 2+ years leading cross-functional manufacturing priorities, factory recovery, equipment readiness, or advanced packaging execution in a 24x7 environment.
• Experience in substrate, assembly, semiconductor packaging, silicon process development, manufacturing operations, or advanced technology development.
• Knowledge of factory operations systems, factory physics, capacity planning, equipment scheduling, excursion management, and floor planning.
• Experience supporting manufacturing ramps, tool qualification, capacity alignment, WIP movement, staffing coordination, and ramp milestones.

Culture & Benefits

• On-site manufacturing environment with a strong focus on safety, quality, accountability, and disciplined execution.
• Health, retirement, and vacation benefits.
• Competitive compensation with potential stock bonuses.
• Work with cross-functional teams delivering advanced packaging technologies and critical technology development milestones.