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2 дня назад

Intel Process Integration Engineer (Semiconductor)

103 730 - 198 820$
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Текст:
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TL;DR
Intel Process Integration Engineer (Semiconductor): Develops and integrates front-end semiconductor process flows for new technology nodes with an accent on yield improvement, device performance, process control, and technology transfer. Focus on analyzing defects and parametric failures, optimizing critical dimensions and process conditions, and supporting the transition from R&D to high-volume manufacturing.

Location: On-site in Hillsboro, Oregon, or Phoenix, Arizona, United States.

Salary: $103,730–$198,820 USD annually.

Company

A global semiconductor technology corporation developing process technologies and advanced manufacturing solutions.

What you will do

  • Develop integrated front-end process flows and establish process windows for new technology nodes.
  • Coordinate process integration activities across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
  • Analyze yield loss, defects, and parametric failures using SPC, DOE, FMEA, and root-cause analysis.
  • Optimize device performance, critical dimensions, overlay, film thickness, and electrical parameters.
  • Implement process control plans, monitoring strategies, capability analysis, and control charts.
  • Support technology transfer from R&D to high-volume manufacturing and document process specifications and SOPs.

Requirements

  • PhD in Electrical Engineering, Physics, Applied Physics, Optics, Materials Science, Chemical Engineering, Mechanical Engineering, or a related discipline.
  • At least 6 months of experience in semiconductor device fabrication, nanotechnology, electrical characterization, or cleanroom process development.
  • Knowledge of semiconductor device physics, including CMOS, FinFET, or GAA architectures.
  • Understanding of VLSI fabrication, testing, semiconductor process equipment, and defect classification systems.
  • Experience with statistical process control, data analysis, design of experiments, and model-based problem solving.
  • Strong stakeholder management and cross-functional collaboration skills.

Nice to have

  • Experience with JMP, MATLAB, Python, JSL, TCL, SQL, or C/C++.
  • Hands-on experience with VLSI device fabrication and laboratory testing.
  • Knowledge of dry etching, ALD, PE-CVD, metallization, automation, and fab data systems.

Culture & Benefits

  • Collaborative environment focused on semiconductor process innovation and technology development.
  • Medical plans, wellness programs, paid time off, recreational activities, and product discounts.
  • Bonuses, life and disability insurance, retirement benefits, stock purchase opportunities, and stock awards subject to eligibility.
  • On-site work model with Shift 1 scheduling.

Hiring process

  • Resume and profile review by recruiters for this and potentially aligned future openings.
  • Interview process includes role-related evaluation; candidates may be assessed through relevant industry experience, internships, coursework, or research.

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