New Product Manufacturing Engineer III - (E3) (Semiconductor Manufacturing)

Location: Santa Clara, CA, United States. Travel required up to 10% of the time. Relocation is not eligible.

Salary: $110,500–$152,000 per year

Company

hirify.global develops materials engineering solutions and equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Commercialize newly designed products and features from initial engineering designs through volume manufacturing.
• Coordinate new product and product improvement releases with engineering, operations, global product management, and suppliers.
• Create, release, approve, and implement engineering change orders, SMBOMs, BOM requests, and NPI/CIP documentation.
• Create and maintain new product models and master layouts in UG-NX, including options, variants, and variant conditions.
• Support new product builds, identify root causes of assembly and test issues, and implement long-term corrective actions.
• Recommend tooling and process requirements and apply DFx principles to improve manufacturability, quality, and cost.

Requirements

• BS degree in an engineering discipline.
• 4+ years of manufacturing or engineering experience, or equivalent; 5–7 years preferred.
• In-depth knowledge of UG-NX, Teamcenter, SAP BOM, and engineering change orders.
• Knowledge of product structure, bills of materials, product safety, material handling, manufacturability analysis, value engineering, and root cause analysis.
• Strong change management, problem-solving, communication, teamwork, quality, and customer-orientation skills.
• Knowledge of supporting tools such as MS Word, Excel, PowerPoint, Flowcharting, FRACAS, BRIO, or Lotus Notes.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs and employee benefits.
• Additional compensation may include bonus and stock awards, where applicable.
• Regular employment with a comprehensive benefits package.