Global Software Support Engineer II (Semiconductor Equipment)

Location: Phoenix, Arizona, United States. Travel required up to 20% of the time. Relocation eligible.

Salary: $86,500–$119,000 per year

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Analyze and resolve moderate-complexity equipment software application and systems issues.
• Investigate customer high-value problems, systemic bugs, and software failures.
• Provide customer software support through the software ticketing system and deliver timely updates to stakeholders.
• Create, test, and verify Software Change Notifications and Key Feature Procedures.
• Contribute to software specifications, design, testing, documentation reviews, and customer-facing feature documentation.
• Provide informal guidance and training to junior engineers on product operation.

Requirements

• High motivation and the ability to self-manage priorities and workload.
• Excellent written and verbal communication skills.
• Ability to work with diverse colleagues in a team environment.
• Knowledge of hirify.global equipment.
• Conceptual knowledge in the relevant discipline and the ability to solve straightforward technical problems using experience and judgment.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonuses and stock awards, where applicable.
• Equal opportunity employment and accessibility support during the application process.