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Automation Engineer (Semiconductor)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Automation Engineer (Semiconductor): Designing and delivering automation and control systems for EFEM, robotics, and factory-automation platforms used in semiconductor and advanced-packaging manufacturing with an accent on substrate handling, equipment integration, and SEMI standards compliance. Focus on integrating PLC, HMI, SCADA, robotics, and data-connectivity solutions, solving complex equipment issues, and ensuring uptime and reliability across front-end, ICAPS, and advanced-packaging processes.

Location: Onsite in Tainan, Taiwan; travel to customer and supplier sites required 25% of the time. Relocation is not eligible.

Company

hirify.global designs, builds, and services equipment used to manufacture semiconductor chips and advanced displays.

What you will do

  • Design, develop, and implement automation and control systems for front-end, ICAPS, and advanced-packaging processes.
  • Integrate automation and control solutions into IPC digital lithography, optical patterned wafer inspection, and contamination and defect inspection systems.
  • Troubleshoot automation, control, and data-connectivity issues and perform root-cause analysis to maintain equipment uptime and reliability.
  • Collaborate with cross-functional teams to identify automation opportunities and define requirements across substrate-handling processes.
  • Develop documentation for automation, control, and data-connectivity systems and processes.
  • Mentor engineers, provide technical guidance, drive continuous improvement, and support the automation roadmap.

Requirements

  • 8+ years of experience in automation, control, or semiconductor equipment engineering.
  • BSEE, BSME, or a related engineering degree.
  • EFEM application expertise from front-end through advanced packaging, including substrate handling for wafers and panels of varying sizes, shapes, and properties, plus loadport, OHT, AGV, and conveyor integration.
  • Experience with industrial robotics applications, including Kawasaki, Yaskawa, Rorze, Hirata, or Daihen, and system integration for automated substrate handling.
  • PLC programming, HMI development, and SCADA development on EFEM and substrate-transfer platforms.
  • Electrical automation design covering control systems, sensors, actuators, electrical circuits, power systems, and control theory.
  • Familiarity with SEMI standards and automation-equipment compliance requirements, including SECS/GEM E30, E84, and E87.
  • Strong troubleshooting and root-cause analysis skills focused on equipment uptime and reliability.
  • Excellent communication, collaboration, organization, time management, and adaptability skills.

Nice to have

  • MS degree in engineering.
  • Mechanical engineering design experience, including geometric dimensioning and tolerancing, mechanism design, material selection, and structural or thermal analysis.
  • Proficiency with AutoCAD, Inventor, or NX.
  • Industry 4.0 experience with IoT, AI/ML, cyber-physical systems, or AI in robotics.
  • Business-process analysis skills for identifying automation opportunities and assessing financial trade-offs.

Culture & Benefits

  • Supportive work culture focused on learning, development, and career growth.
  • Collaborative environment with cross-functional engineering teams.
  • Employee health and wellbeing programs supporting personal and professional development.
  • Regular employment with a full-time work model.

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