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2 часа назад

Staff Mechanical Design Engineer (Semiconductor Capital Equipment)

170 000 - 225 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Staff Mechanical Design Engineer (Semiconductor Capital Equipment): Designing complex wafer-processing equipment, vacuum vessels, ion beam sources, subassemblies, and components with an accent on system design, analytical engineering, reliability, and manufacturability. Focus on finite element analysis, thermal and structural calculations, prototype testing, SEMI safety compliance, engineering documentation, and mentoring junior engineers.

Location: San Jose, California, United States

Salary: $170,000–$225,000 annually, plus bonus opportunity

Company

Designs, develops, manufactures, and services advanced semiconductor process equipment for wafer processing, thin-film deposition, LEDs, displays, power electronics, MEMS, and wireless chips.

What you will do

  • Own mechanical design for capital equipment, subassemblies, and components across fast-paced new product development projects.
  • Design system architectures, vacuum vessels, ion beam sources, and integrations with OEM components.
  • Perform structural, thermal, fluid dynamics, heat transfer, vacuum, and motion mechanism analyses.
  • Define mechanical specifications, ensure SEMI and safety-code compliance, and develop reliable test plans and experiments.
  • Lead design reviews, prototype development, testing, engineering documentation, procurement support, and manufacturing assistance.
  • Mentor junior engineers and provide technical guidance and design reviews.

Requirements

  • BS in Mechanical Engineering with at least 12 years of experience, or MS with at least 8 years of experience.
  • Experience designing capital equipment, vacuum systems, subassemblies, or components.
  • Experience with SolidWorks, Inventor, Creo, or a similar 3D CAD system.
  • Required expertise in structural and thermal finite element analysis and hands-on troubleshooting.
  • Required knowledge of semiconductor equipment design, including RF systems, plasma chambers, ESCs, and defectivity management.
  • Ability to work hands-on with devices and prototypes, stand for extended periods, and travel up to 20% to customer or supplier sites.

Nice to have

  • Knowledge of industrial controls, sensors, automation, robotics, instrumentation, motion control, motor selection, encoders, and electronic packaging.
  • Experience with SAP or a similar PLM system.
  • Project management experience.

Culture & Benefits

  • Multidisciplinary environment involving internal teams, suppliers, customers, and manufacturing.
  • Medical, dental, and vision insurance.
  • 401(k) with company match and employee stock purchase plan.
  • Holiday, vacation, sick time, flexible spending accounts, and commuter benefits.
  • Life, accident, and disability insurance, tuition reimbursement, employee assistance, identity theft remediation, and emergency travel assistance.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted before an offer.

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